Modeling of Wet Adhesion of Microstructures in Shock Environment

Jie-Ying Tang

DOI: https://doi.org/10.1117/12.835690

2009-01-01

Abstract:Adhesion, as one of the most common failure modes compromising reliability of optical MEMS devices, attracted great research interests for enhancing the production yields and device reliability. Experiments show that wet-adhesion with respect to capillary force between interfaces of movable structures is generally the dominant figure among all adhesion natures. Great efforts had been made on examine adhered length of micro-cantilevers to modeling adhesion energy, which are reasonable to predict adhesion in quasi static process such as sacrificial layer release processes. However, the microcosmic mechanism of adhesion has not been well revealed, thereby these models are not sufficiently precise for in-situ adhesion, such as adhesion due to mechanical shock. In this work, a novel model of adhesion energy is derived by review the physical mechanisms carefully and shock caused adhesion is studied applying this model.