The Analysis Of Contact Mechanics Considering The Adhesive Effect And Micro-Void Damage

Qun-Yang Li,Shou-Wen Yu
2006-01-01
Abstract:With the rapid development of Micro-Electro-Mechanical System (MEMS), we enter a field in which the surface effects have dominated many of the micro-scale phenomena, and the adhesive contact is one of the focuses. In this paper, based on the Gurson model considering the initiation and growth of micro-void damage, the response of contact mechanics and the evolution of the micro-void damage are calculated by using finite element method considering the adhesive effect and micro-void damage simultaneously. The results of calculation of Gurson model show that for the curves P similar to a and P similar to delta, the void growth and adhesion cannot be ignored comparing with the results of conventional elastic-plastic contact mechanics.
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