Abstract:The batch production and performance evaluation of the spherically bent crystal analyzers fabricated for the `Qian Kun' X‐ray Raman spectrometer at the High Energy Photon Source in China are reported. Radially dicing thin silicon wafers was found to be more effective in relieving stress than conventional strip cuts in the case that the total number of divided blocks is roughly the same.X‐ray Raman scattering (XRS) spectroscopy is an emerging inelastic scattering technique used to measure local electronic structure and chemical bonding around low‐Z atoms with hard X‐rays. This technique is useful in environments where traditional soft X‐ray techniques are not applicable. However, the small cross section of XRS requires that the spectrometer must simultaneously achieve large solid angles and good energy resolution. A large XRS spectrometer named `Qian Kun' is currently under construction at the High Energy Photon Source (HEPS) in China, which can hold up to 100 analyzers with an energy resolution in the range 0.4–1.0 eV. Here, the batch production and performance evaluation of the spherically bent crystal analyzers fabricated for this spectrometer are reported. The stress‐relief effect of various dicing patterns and their impact on the reflectivity properties of crystal analyzers to achieve good energy resolution when studying the near‐edge features of carbon and oxygen K edges were investigated. It was discovered that radially dicing the thin silicon wafers is more effective in relieving stress than conventional strip cuts in the case that the total number of divided blocks is roughly the same.

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Low-Frequency Raman Scattering of Ge and Si Nanocrystals in Silica Matrix

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Raman Scattering Intensities of Folded Longitudinal Acoustic Phonons in Ge X Si 1- X / Si Superlattices

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Probing Energy‐Funneling Kinetics in Nanocrystal Sublattices for Superior X‐ray Imaging

Sub-Micron Imaging Of Sub-Surface Nanocrystalline Structure In Silicon

Space- and Angle-Resolved Vibrational Spectroscopy to Probe the Local Phonon Modes at Planar Defects

Optimizing the slicing pattern of stress‐relief crystal analyzers for X‐ray Raman scattering