Capability Study on the Destructive Pull Test of 1 Mil Gold Wire Bond and Its Asymmetric Distribution

Jin Peng
DOI: https://doi.org/10.1109/icept.2008.4607119
2008-01-01
Abstract:The Statistical Process Control (SPC) of destructive pull test on 1 Au gold wire is studied on two High-Rel devices, namely #1 and #2. It was found that the Cpk of both parts are around 1.2, which have not meet our goal of 1.33 and the ultimately Six Sigma (Cpk=2). However, this study shows that the traditional method of calculating Cpk has underestimated the capability of process control if considering the tolerance as asymmetric, such as the case for 1 mil gold wire bond.
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