The Synthesis and Curing Kinetics of the Silicon-Containing Epoxy Resin with Environmentally Friendship Flame Retardance

Yang Ming-shan,He Jie,Li Lin-kai,Liu Zhen
DOI: https://doi.org/10.1109/icept.2008.4607083
2008-01-01
Abstract:Silicon-containing epoxy resin (CNE-Si) was synthesized from diphenylsilandiol (DPSD) and ortho-cresol novolac epoxy resin using SnCl2 as catalyst. The chemical structure of CNE-Si prepared in this paper was characterized by 1H-NMR and FTIR. The thermal stability was analyzed by TGA. The result showed that the -Si- group enhanced the thermal stability of the epoxy resin. The curing kinetics of the system was studied by non-isothermal DSC. The kinetic parameters of the curing reaction including the activation energy were calculated using Kissinger and Ozawa method. The results showed that the system containing CNE-Si has lower curing temperature and more quick curing speed compared to CNE, which offers basic data for the application of CNE-Si in large-scale circuit packaging.
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