Abstract:This study using electrically conductive adhesives (ECAs) contacting solar cell metallization pastes shows that the impact of silver content on the bulk (adhesive) resistivity and (bond) contact resistivity depends on the conductive particle geometry. By mixing high and low surface area (to volume ratio) particles, it is found that both resistivities strongly depend on the particle ratio. Hence, developers can reduce silver content with minimal loss of performance by focusing on optimizing particle shape and ratio in multimodal compositions. Our previous work highlighted how microscopic structural effects influence the sheet and contact resistance of electrically conductive adhesives (ECAs). Herein, we delve further by investigating how the contact and bulk resistivity of several ECAs that are based on the same formulation, but with different filler content, are correlated with the filler content. Additionally, two different filler geometries — high and low surface area (HSA and LSA) fillers — are combined in different ratios to maintain a similar viscosity and therefore processability. Hence, contact and bulk resistivities are also correlated with the different geometry ratios of these two fillers. As expected, it was found that the contact and bulk resistivities decreased when the filler content was increased. However, the magnitude of the decrease was found to depend strongly on the filler geometry ratio. At extreme filler geometry ratios, when the bulk is either mostly loaded with HSA‐fillers or mostly with LSA‐fillers, the impact of changes in the filler content on the bulk and contact resistivities is markedly different. The measured data is interpreted within the context of percolation theory and it is determined that the optimum ratio of the LSA and HSA Ag‐fillers investigated in this study is approximately 60:40 (for an epoxy‐based adhesive). This work has important ramifications for the design of ECAs, where cost considerations and the need to reduce silver resource usage demand the lowest (silver) filler content, but the demands of product performance point to higher filler content.

Preparation of Electrically Conductive Filler for Anisotropic Conductive Adhesive

Effects of Nano Fillers on the Conductivity, Adhesion Strength and Reliability of Isotropic Conductive Adhesives (ICAs)

A Study on the Preparation and Properties of Conductive Adhesive Filled with Multi-component Fillers for Green Packaging

The synergistic effect of micron spherical and flaky silver-coated copper for conductive adhesives to achieve high electrical conductivity with low percolation threshold

Preparation of silver nanopowders and its application in low temperature electrically conductive adhesive

Silver Flakes and Silver Dendrites for Hybrid Electrically Conductive Adhesives with Enhanced Conductivity

Preparation and characterization of Ag conductive adhesive with low resistivity

The Preparation of Polystyrene/nickel Core-Shell Particles for Anisotropic Conductive Films (Acfs)

Regulation of Multidimensional Silver Nanostructures for High-Performance Composite Conductive Adhesives

Recent Progress of Electrically Conductive Adhesives with Nano-fillers

The Mixture of Silver Nanowires and Nanosilver-Coated Copper Micronflakes for Electrically Conductive Adhesives to Achieve High Electrical Conductivity with Low Percolation Threshold

Preparation of silver-coated copper powders and its application in conductive adhesives

Electrical property enhancement of electrically conductive adhesives through Ag-coated-Cu surface treatment by terephthalaldehyde and iodine

Scalable Synthesis of Monodispersed Branched Submicron Silver Particles As the Printed Electrically Conductive Adhesives Fillers

Electrically conductive adhesives filled with surface modified copper particles

Fabrication of Interconnected Silver Flakes for Conductive Adhesives Through Dopamine-Induced Surface Functionalization

Effect of Flake Silver-Plated Copper Particles on the Property Enhancement of Electrically Conductive Adhesives.

Preparation of micron-scale Cu@Ag conductive particles by displacement coating to reinforce epoxy conductive adhesives

Surface Treatment of Micron Silver Flakes with Coupling Agents for High-Performance Electrically Conductive Adhesives

Preparation of Low Volatile Organic Compounds Silver Paste Containing Ternary Conductive Fillers and Optimization of Their Performances

The effects of increasing filler loading on the contact resistivity of interconnects based on silver–epoxied conductive adhesives and silver metallization pastes