Thermal management of a passively cooled LED-based large area direct backlight for LCDs

Changbo Zhou,Keyuan Qian,Luo, Yi

DOI: https://doi.org/10.1109/INOW.2007.4302977

2007-01-01

Abstract:Influence of temperature on color and luminance uniformity of LED-based direct backlight is investigated. A thermal management scheme is proposed. The color difference introduced by temperature is reduced by 50%.

What problem does this paper attempt to address?

Experimental Study and Taguchi Analysis on LED Cooling by Thermoelectric Cooler Integrated with Microchannel Heat Sink

Xiaohui Lin,Songping Mo,Lisi Jia,Zhi Yang,Ying Chen,Zhengdong Cheng

DOI: https://doi.org/10.1016/j.apenergy.2019.03.071

IF: 11.2

2019-01-01

Applied Energy

Abstract:Effective thermal management is crucial for light-emitting diodes (LED). Thermoelectric cooler (TEC) and microchannel heat sink (MHS) have been demonstrated to be effective for thermal management of LED. However, neither the combination of these two methods, nor the dominant factors which could be effectively adjusted to control the LED temperature, have been reported. In this study, a cooling device integrating TEC and water-cooled microchannel heat sink (WMHS) is proposed to improve the thermal management of high-power LED headlights. The start-up performance of the proposed device, LED + TEC + WMHS, was evaluated and compared with three different systems, namely LED + WMHS, LED + AHS (air-cooled heat sink), and LED + TEC + AHS. Experimental results have demonstrated the best performance of the LED + TEC + WMHS device. Orthogonal experiments based on the Taguchi method were conducted to reveal dominant factors among four variables, including TEC current, water inlet temperature, water flow velocity, and ambient temperature. The results show that effects of all the factors were significant while the TEC current has most important influence on the performance. The variation of the thermal management performance with the levels of the factors were investigated. The LED temperature was only 60.0 degrees C even at severe working conditions (T-a = 80 degrees C, T-i = 55 degrees C) and moderate cooling input (I-TEC = 2 A, u = 0.49 m/s), indicating great thermal management performance of the proposed method. Choosing a cooling system and adjusting the factor levels for different applications were recommended.
Direct Design of Thin and High-Quality Direct-Lit LED Backlight Systems

Zhanghao Ding,Yingli Liu,Yaoguang Ma,Zhenrong Zheng,Min Wang,Ping Zeng,Jun She,Rengmao Wu

DOI: https://doi.org/10.1109/jphot.2021.3068746

IF: 2.4

2021-01-01

IEEE Photonics Journal

Abstract:The direct-lit LED backlight is a key component in large-area LCD displays. The existing methods which rely on point source assumption and irradiance feedback are less effective in compact designs in near field, and designing thin and high-quality back-lit LED backlights still remains a challenging issue. In this paper, we develop a direct method for designing thin and high-quality back-lit LED backlight systems. The étendue of LED light sources is considered in the numerical calculation of the lens profiles without cumbersome Monte Carlo ray tracing, which allows us to obtain compact LED lighting modules and achieve accurate control of the near-field irradiance distribution of the backlight system. Two examples are presented to demonstrate the elegance of this method in designing thin and high-quality back-lit LED backlights.
Effect of LED Wavelength Consistency and Temperature Uniformity on Color Difference of LCD Backlight

LIU Yuyuan,LUO Yi,HAN Yanjun,QIAN Keyuan

2010-01-01

Abstract:Direct dynamic backlights based on trichromatic LEDs have significant advantages for liquid crystal display (LCD) such as wide color gamut, long lifetime, energy saving, high contrast and so on. However, its color rendering capacity was influenced by several factors. The effect of LED wavelength consistency and temperature uniformity of the backlight on color difference of direct dynamic backlights based on trichromatic LEDs is investigated. Experimental results show that,to keep the color difference indecipherable for human eyes, the fluctuation of LED wavelength should be held within 5 nm and the largest temperature difference among LEDs in the whole backlight should be less than 8℃.
Thermal Analysis and Design of High-Power LED Street Light

Kai Yang,Yuqing Chen,Bin Lin,Jidong Song

DOI: https://doi.org/10.1109/SOPO.2010.5504439

2010-01-01

Abstract:LED is called the fourth generation of lighting, which has already been widely used in display and illumination devices. The junction temperature has directly influence upon the life time and reliability of high-power LED, so keeping the junction temperature of LED is a key issue. A method researching radiators based on finite element analysis was introduced. In this paper, the heat performance of LED COB (chip on board) packaging was studied. The radiating model of LED street lamp with a radiator was introduced, and simulated the changing of parameters of radiator by ANSYS.
Thermal Management for Microscale Inorganic Light-Emitting Diodes

CUI Yun,XING YuFeng,LI YuHang,SONG JiZhou

DOI: https://doi.org/10.1360/sspma2015-00547

2016-01-01

Abstract:Inorganic Light-Emitting Diodes (ILEDs) are attractive for broad classes of applications in solid-state lighting, optical communication, and optogenetics due to their high efficiency, fast response, and long lifetime etc. The recently developed flexible ILED enables lots of novel applications especially in bio-integrated therapeutic devices that could be integrated with soft tissues well because they are able to be deformed like a rubber band. The low thermal conductivity of the elastomeric substrate in flexible ILEDs, which is about 3 orders of magnitude lower than that of the typical substrate for conventional ILEDs, imposes critical challenges in the thermal management. In this paper, an analytical model, validated by three dimensional finite element simulations, is developed to study the thermal properties of microscale inorganic LEDs with a rectangular shape. The temperature rise of ILED is derived analytically and agrees well with finite element simulations. A simple scaling law for the ILED temperature rise is then established in terms of the material and geometrical parameters. It is found that the ILED temperature rise depends on only 4 non-dimensional parameters. These results pave the basis for thermal management of flexible ILEDs and provide design guidelines for minimizing their adverse thermal effects on the performance as well as in applications.
Thermal Management Analysis of LED Luminaire for Road Lighting

Zhang Wanlu,Jiang Lei,Jiang Cheng,Chen Yuyang,Liu Muqing

DOI: https://doi.org/10.3969/j.issn.1002-6150.2009.02.002

2009-01-01

Abstract:With the progress of LED technology,heat dissipating becomes the key barrier which restrict development of LED luminaire for road lighting.This paper first introduces the influence of temperature rise on the performance of white LED.On the base of analyzing the structure of LED road light and heat transfering theory,we build a thermal model of LED road light.According to two popular heat managing modes,we choose several samples separately to test their steady junction temperature.By analyzing the result and combining the thermal model,we research on the main factors affecting heat dissipating efficiency of luminaire and bring forward some guidance to the heat sink design of LED road light.
Direct Dynamic LCD Backlight Based on LED

刘佳尧,钱可元,韩彦军,罗毅

DOI: https://doi.org/10.3969/j.issn.1007-2780.2008.04.011

2008-01-01

Abstract:Direct dynamic backlights have significant advantages over static backlights for liquid crystal display (LCD). This study introduced a structure of direct dynamic backlights based on LEDs,in which the light emission of every LED was restricted to a smaller area on the diffuser film and every LED was only responsible to illuminate one part of LCD. Based on this structure,a 240 mm×180 mm backlight model was analyzed theoretically. The simulation results showed that the uniformity of luminance can reach as high as 93.1%,and ΔU′V′ can decrease to 0.003 545,which completely satisfies the requests of backlight's applications.
Thermal Management In Led Packaging And Applications

Xiaobing Luo,Run Hu

DOI: https://doi.org/10.1615/AnnualRevHeatTransfer.2015011154

2015-01-01

Abstract:Although white light-emitting diodes (LEDs) have been widely used in our daily lives, they still suffer from overheating that limits the reliability and longevity of these devices. Hence, thermal management is indispensable in LED packaging and applications. The objective of this chapter is to describe LED thermal management techniques at three levels, i.e., chip level, module level, and system level. First, heat generation within the LED chip structure is calculated with the knowledge of solid-state physics or even quantum physics models. Then, the effects of LED packaging processes on the thermal behavior are analyzed. Moreover, the practicality of various kinds of thermal solutions for LED system is discussed. Recent advances in thermal management of high-power LEDs is also reviewed to provide comprehensive discussions for interested readers.
Design of High Uniformity LED Backlight

ZHOU Xi-jun,FENG Shi-meng

DOI: https://doi.org/10.3788/yjyxs20122706.0774

2012-01-01

Chinese Journal of Liquid Crystals and Displays

Abstract:Currently,more and more liquid crystal displays are towards to the low-power,which the effective method is reducing the number of LEDs as the light source.However,as the decrease of LED pixel,hot spot will increase fast.To solve above problem,without changing the distance between LED and guide plate,and with increasing the distance between LED and LED as well as incident angles of guide light plate,light in guide light plat is completely mixed by using this method,and light uniformity is much more improved.Hot spot in the LED backlight module are also solved.This research has good significance for LCD display.
Cooling of High Power LEDs Through Ventilating Ambient Air to Front Surface of Chip

Lu Ma,Yang,Jing Liu

DOI: https://doi.org/10.1007/s00231-012-1067-x

2013-01-01

Heat and Mass Transfer

Abstract:In this study, a novel cooling strategy through ventilating ambient air to the front surface of the hot chips of the high power light-emitting diodes (LEDs) was proposed to tackle the ever tough issues facing the conventional thermal management approaches. Preliminary thermal resistance analysis, numerical simulation and conceptual experiments were carried out to evaluate the cooling performance thus enabled. In the system analysis, a thermal network model was established to characterize the thermal resistance of an ordinary high power LED light and that of the newly proposed light module. Through ventilating the high speed ambient airflow directly onto the chip surface, the thermal resistance of the whole light could be evidently reduced and additional pathway was thus opened for releasing heat from the chips. Further, three-dimensional finite volume simulations were adopted to investigate the temperature distribution of the new light. It was found that even without heat sink or active cooling at the back part of the LED light, the new method via cooling the front part still works well. Lastly, a conceptual experiment was performed, which again demonstrated that cooling the LED at its front surface suggests an effective way to maintain the safe running of LED light within an allowable temperature scale just as cooling the light at the back part. The present method initiates a new way for future thermal management of high power LEDs.
Performance simulation of diffuser with microstructure for LCD backlight system

Yongmin Shi,Qiaofeng Tan

DOI: https://doi.org/10.1117/12.869875

2010-01-01

Abstract:Direct-light type backlight module is widely used for large size liquid crystal displays (LCDs). Many methods have been proposed to thinner the thickness and simplify the structure. In this paper a new kind of diffuser, with micro prisms on the top and micro spheres on the bottom, is used to reduce the thickness for the direct-light type backlight module. Simulated results show the microstructures on the diffuser can help to reduce the thickness between the diffuser and the light source, while keeping the illumination uniformity and increasing the light efficiency.
Study on LED array heat transfer under natural convection based on CFD

WANG Le,WU Ke,YU Yi-bo,SUN Da-ming,HUANG Zhi-yi

2010-01-01

Abstract:Based on computational fluid dynamics（CFD） method,a full-field three-dimensional mathematical model of LED hardware and external fluid space are constructed and the natural convection and the radiation heat transfer are calculated by k-ε model with buoyancy correction and P-1 model,respectively.Simulations are carried out by this mathematical model and the obtained results are verified by physical experiments.The results show that the temperature field and the heat transfer coefficient are distributed anisotropically.The former is caused by the LED chip power density and spatial location,while the latter is resulted from the flow state of external fluid.Furthermore,the radiation plays an important role in the whole heat transfer process,which not only reduces thermal resistance and lowers LED junction temperature,but also weakens temperature field inhomogeneity and increases heat transfer efficiency.Under the calculational conditions in this paper,the radiaton heat transfer occupies 23.3% of the whole heat transfer.
Latest Advancement of Thermal Management for High Power LED

MA Lu,LIU Jing

DOI: https://doi.org/10.16818/j.issn1001-5868.2010.01.002

2010-01-01

Abstract:The temperature of the LED chip directly influences its light-emitting efficiency, working life and reliability. Through interpretation on thermoresistance of each component, several latest thermal management methods ranging from chip to system level for the high-power LED products are comprehensively reviewed, such as natural convective cooling, forced convective cooling based on piezoelectric fan and ionization approach, liquid cooling using water and liquid metal as coolant, two phase fluid cooling via heat pipe, solid cooling schemes with thermoelectric device and the heat recycle strategy using thermoelectric device to convert waste heat to electricity and thus power the active cooling system. On the basis of above-mentioned cooling schemes, several key problems in the thermal management of high power LED products are summarized.
Orthogonal study and analysis of variance on a thermal management system for high-power LED package.

Jiarong Ye,Xiaohui Lin,Songping Mo,Lisi Jia,Ying Chen,Zhengdong Cheng

DOI: https://doi.org/10.1016/j.mejo.2020.104969

2021-01-01

Abstract:Determination of influences of various factors is important for improvement and optimization of a thermal management system for microelectronics. In this study, a series of orthogonal experiments and analysis of variance were performed on an LED cooling system which integrates thermoelectric cooler with microchannel heat sink using nanofluid as coolant. The significance of four factors, including nanofluid concentration, ambient temperature, nanofluid temperature, and power of the thermoelectric cooler, were evaluated. Substrate temperature was measured and temperature distribution of the LED was estimated. Results indicate that nanofluid demonstrated better cooling capacity compared with water. Results of difference analysis and analysis of variance indicate that all the four factors showed significant effects on the LED temperature, while the dominant factor was nanofluid concentration. The optimum nanofluid concentration was obtained. The variation of the nanofluid effect on the cooling performance with ambient temperature and nanofluid temperature were observed. The influence of dispersion stability of the nanofluid on the cooling performance was discussed.
Luminaries-level Structure Improvement of LEDs for Heat Dissipation Enhancement under Natural Convection

KE WU,LE WANG,YI-BO YU,ZHI-YI HUANG,PEI LIANG

DOI: https://doi.org/10.1007/s12046-013-0157-x

2013-01-01

Sadhana

Abstract:Heat dissipation enhancement of LED luminaries is of great significance to the large-scale application of LED. Luminaries-level structure improvement by the method of boring through-hole is adopted to intensify heat dissipation. Furthermore, the natural convection heat transfer process of LED luminaries is simulated by computational fluid dynamics (CFD) model before and after the structural modification. As shown by computational results, boring through-hole is beneficial to develop bottom-to-top natural convection, eliminate local circumfluence, and finally form better flow pattern. Analysis based on field synergy principle shows that boring through-hole across LED luminaries improves the synergy between flow field and temperature field, and effectively decreases the thermal resistance of luminaries-level heat dissipation structure. Under the same computational conditions, by luminaries-level structure improvement the highest temperature of heat sink is decreased by about 8°C and the average heat transfer coefficient is increased by 45.8%.
Study on LED Array Heat Radiator Improvement under Natural Convection

WANG Le,WU Ke,YU Yi-bo,SUN Da-ming,HUANG Zhi-yi,GU Pei-fu

DOI: https://doi.org/10.16136/j.joel.2011.03.017

2011-01-01

Abstract:Heat transfer intensification of high power LED radiator is of great significance to large-scale application of LED.Plate fin radiator,which has been widely used in LED lighting system,is improved by slotting in this study.Natural convection heat rejection of LED array was simulated by computational fluid dynamics(CFD) method before and after the structural modification.As shown by computational results,strip fin is propitious to forming bottom-up natural convection,thereby eliminating local circulation and improving heat transfer performance.Under the same computational condiction,strip fin help lower the highest temperature of radiator by about 8 ℃ and increase average heat transfer coefficient by 67.5%.Analysis based on field synergy principle indicates that strip fin has improved the synergy between velocity and heat vectors,and effectively decreased the heat resistance of radiator with same heat transfer area.
Improvement for Lightness Uniformity of LED Backlight

LIU Qian-fei,ZHANG Xiao-ning,LIU Chun-liang,DING Xing-long

DOI: https://doi.org/10.16540/j.cnki.cn11-2485/tn.2009.06.011

2009-01-01

Abstract:A non-uniform arrangement of light-emitting diode(LED) to improve the lightness uniformity of LED backlight is proposed for the low lightness on the edge of the direct LED backlight in liquid crystal display.Based on the uniform arrangement,the lightness distribution function of a single LED is measured.Then the distance of LED in horizontal and vertical direction of non-uniformity arrangement is calculated and optimized.The results of calculating the lightness uniformity for non-arrangement of LED shows that the lightness uniformity can be achieved above 90%.
Heat Dissipation for LED Lighting: Vapor Chamber Substrate Printed Circuit Board

ZhongJie Huang,Zhong Cheng,Mingguang Wu

DOI: https://doi.org/10.1109/ICIEA.2010.5517072

2010-01-01

Abstract:Heat dissipation is an inevitable subject during the design of light emitting diode (LED) lighting, especially for museums and medical equipment. In this paper, a novel substrate technology for an effective solution to two major problems that affect the heat dissipation performance has been introduced. (1) The non-uniform junction temperature of the module across the LED arrays and the uneven operational temperature of LED arrays; (2) The high operational temperature caused by the accumulated heat. This new type of Vapor chamber substrate printed circuit board (PCB) consists of a thermally-conductive Vapor chamber substrate which is insulated by a dielectric layer of aluminum nitride (ALN). Circuit is formed on the dielectric layer with pulse magnetron sputtering technology. Experimental results in the form of average temperature show that the vapor chamber substrate PCB can improve the temperature uniformity. And good thermal performance for high power LED arrays can also be achieved.
Uniformity improvement of a mini-LED backlight by a quantum-dot color conversion film with nonuniform thickness.

Y. Ye,Enguo Chen,Liwen Deng,Qun Yan,Yu Chen,Sheng Xu,Tailiang Guo,Junhu Cai,Wenyan Zhang

DOI: https://doi.org/10.1364/ol.505552

IF: 3.6

2023-10-06

Optics Letters

Abstract:Mini-LED backlights energized by quantum-dot color conversion (QDCC) hold great potential for technological breakthroughs of liquid crystal displays. However, luminance uniformity issues should still be urgently solved owing to the large interval of direct-lit mini-LEDs, especially when covering with a QDCC film (QDCCF) with uniform thickness. Herein, we propose a uniformity improvement approach of mini-LED backlights by employing a QDCCF with nonuniform thickness based on the Lambertian distribution of mini-LEDs, which is demonstrated by screen-printing preparation and ray-tracing simulation. Experimental results show that the luminance uniformity of the nonuniform QDCCF can reach 89.91%, which is 24.92% higher than the uniform one. Ray-tracing simulation further elaborates the mechanism of this significant improvement. Finally, by employing this nonuniform QDCCF, a mini-LED backlight prototype is assembled and achieves high uniformity of 92.15%, good white balance with color coordinates of (0.3482, 0.3137), and high color gamut of 109% NTSC. This work should shed some new light on mini-LED-based display technology.

Physics,Engineering,Medicine,Materials Science
Thermal management of high-power LED based on thermoelectric cooler and nanofluid-cooled microchannel heat sink

Xiaohui Lin,Songping Mo,Bingzhong Mo,Lisi Jia,Ying Chen,Zhengdong Cheng

DOI: https://doi.org/10.1016/j.applthermaleng.2020.115165

IF: 6.4

2020-05-01

Applied Thermal Engineering

Abstract:Effective thermal management for light-emitting diodes (LEDs) is critical, as temperature significantly affects their lifetime and performance. In this study, a system combining a thermoelectric cooler (TEC) and a microchannel heat sink (MHS) is investigated experimentally for thermal management of high-power LEDs. Nanofluids and water are used as coolant. The LED substrate temperature (Ts) is measured at various TEC powers, nanofluid concentrations, ambient temperatures of LED (Ta), and ambient temperatures of the fluid radiator (Ta,f). The effective thermal resistance (Rs-fa) of the LED substrate to the ambient of the fluid radiator is analyzed. Correlations of Ts and Rs-fa are obtained. Results show that the Ts is lowest when the TEC works at its rated power, and Ts is lower than Ta at Ta ≥ 55 °C. Using nanofluids instead of water as coolant reduces the Ts by up to 18.5 °C and decreases the thermal resistance by as much as 42.4%. The MHS heat transfer capacity is increased by 38.6%. The Ta,f exhibites greater influence on Ts compared to Ta. Results show that favorable performance of the thermal management of the high-power LED is obtained by the proposed nanofluid-cooled TEC-MHS system, particularly at high ambient temperature of LED.

energy & fuels,engineering, mechanical,thermodynamics,mechanics

Thermal management of a passively cooled LED-based large area direct backlight for LCDs

Experimental Study and Taguchi Analysis on LED Cooling by Thermoelectric Cooler Integrated with Microchannel Heat Sink

Direct Design of Thin and High-Quality Direct-Lit LED Backlight Systems

Effect of LED Wavelength Consistency and Temperature Uniformity on Color Difference of LCD Backlight

Thermal Analysis and Design of High-Power LED Street Light

Thermal Management for Microscale Inorganic Light-Emitting Diodes

Thermal Management Analysis of LED Luminaire for Road Lighting

Direct Dynamic LCD Backlight Based on LED

Thermal Management In Led Packaging And Applications

Design of High Uniformity LED Backlight

Cooling of High Power LEDs Through Ventilating Ambient Air to Front Surface of Chip

Performance simulation of diffuser with microstructure for LCD backlight system

Study on LED array heat transfer under natural convection based on CFD

Latest Advancement of Thermal Management for High Power LED

Orthogonal study and analysis of variance on a thermal management system for high-power LED package.

Luminaries-level Structure Improvement of LEDs for Heat Dissipation Enhancement under Natural Convection

Study on LED Array Heat Radiator Improvement under Natural Convection

Improvement for Lightness Uniformity of LED Backlight

Heat Dissipation for LED Lighting: Vapor Chamber Substrate Printed Circuit Board

Uniformity improvement of a mini-LED backlight by a quantum-dot color conversion film with nonuniform thickness.

Thermal management of high-power LED based on thermoelectric cooler and nanofluid-cooled microchannel heat sink