Effects of Ti Containing Cu-Based Alloy on Sintering Mechanism, Element Diffusion Behavior and Physical Properties of Glass-Ceramic Bond for Cubic Boron Nitride Abrasive Tool Materials
Xianglong Meng,Bing Xiao,Hengheng Wu
DOI: https://doi.org/10.3390/mi14020303
2023-01-24
Abstract:Ti containing Cu-based (TC) alloy reinforced glass-ceramic bond was fabricated for cubic boron nitride (CBN) abrasive tool materials, and its crystal composition, phase transformation, sintering activation energy, microstructure, element diffusion mathematical model, physical properties, and the bonding mechanism between the TC alloy reinforced glass-ceramic bond and the CBN grains were systematically investigated. The results showed that the structure, composition and sintering behavior of glass-ceramic were influenced by TC alloy adding. The generated TiO2 affected obviously the precipitation of β-quartz solid solution Li2Al2Si3O10, thus improving the relative crystallinity, mechanical strength and thermal properties. By establishing the mathematical model for element diffusion, the element diffusion coefficients of Ti and Cu were 7.82 and 6.98 × 10-11 cm2/s, respectively, which indicated that Ti diffused better than Cu in glass-ceramic. Thus, Ti4+ formed a strong Ti-N chemical bond on the CBN surface, which contributed to improving the wettability and bonding strength between CBN and glass-ceramic bond. After adding TC alloy, the physical properties of the composite were optimized. The porosity, bulk density, flexural strength, Rockwell hardness, CTE, and thermal conductivity of the composites were 5.8%, 3.16 g/cm3, 175 MPa, 90.5 HRC, 3.74 × 10-6 °C-1, and 5.84 W/(m·k), respectively.