First-principles study on adhesive work, electronic structures and mechanical properties of Cr/Ti-doped Cu(100)/diamond(100) interfaces
Zihan Deng,Lu Jinbin,Hongzhe Li,Yi Wu,Xinyu Xu,Qing Miao,Wangxi Zhang
DOI: https://doi.org/10.2139/ssrn.4959843
IF: 3.806
2024-12-12
Diamond and Related Materials
Abstract:For brazed tools, diamond is an optimal abrasive to process the hard and brittle materials, and the interface reaction between it and the filler alloy determines the performance of the brazed tools. This paper uses the first-principles methods to investigate the microscopic interaction behavior and formation mechanism of the interface between the Cr/Ti-doped Cu-based solid solution and diamond. We established four types of Cu-based solid solution(100)/diamond(100) interface models and calculated the adhesive work, interface structures, electronic structures, population analysis, and density of states. The results indicate that the adhesive work of the interfaces doped with Cr and Ti can be increased by about 16.6 % and 10.5 %, respectively, and it can continue to increase by 21.9 % and 4.1 % when the doping proportion is increased. In addition, the investigation of the electronic structures, population analysis, and density of states show that Cr and Ti elements facilitate the formation of more substantial chemical bonds at the interface. Therefore, doping Cr/Ti element can improve the bonding strength between diamond and Cu-based solid solution and enhance the wettability of Cu-based filler alloy to the diamond. Notably, the effect of doping the Cr element is significantly better than that of Ti, and the calculated results are also consistent with the experimental findings.
materials science, multidisciplinary,physics, applied, condensed matter, coatings & films