Overview and applicability of residual stress estimation of film–substrate structure
Tsung-Lin Chou,Shin-Yueh Yang,Kuo-Ning Chiang
DOI: https://doi.org/10.1016/j.tsf.2011.04.220
IF: 2.1
2011-09-01
Thin Solid Films
Abstract:Residual stresses arising from thermal mismatch in layered structures rank among the major causes of mechanical failures in light-emitting diodes, integrated circuits, electronic packages, and micro-electro-mechanical systems. Applying analytical solutions to predict or calculate residual stresses’ magnitude and distribution in multilayer film–substrate system has been widely adopted by many researchers. These researches are based on multilayer theories of film–substrate systems, such as Suhir's formula, Stoney's equation, and extend Stoney's equations. To discuss and distinguish the characteristics of these approaches, finite element analysis numerical solutions and multilayer theory analytical solutions are compared and analyzed. This encompasses the theories’ application spectrum as well as their prediction capability. In addition, this work not only discusses the theories’ property and workability but also demonstrate the feasibility of the finite element method (FEM) and bilayer theories in experiment. The experimental result demonstrates that FEM is a reliable approach in predicting the mechanical behavior of multilayer structures. Hence, when calculating or predicting thin film stress using the aforementioned theories, the methodology proposed in this research can be employed to effectively validate the feasibility of these theories.
materials science, multidisciplinary,physics, applied, condensed matter, coatings & films