Abstract:Low-temperature plasma technique is one of the critical techniques in IC manufacturing process, such as etching and thin-film deposition, and the uniformity greatly impacts the process quality, so the design for the plasma uniformity control is very important but difficult. It is hard to finely and flexibly regulate the spatial distribution of the plasma in the chamber via controlling the discharge parameters or modifying the structure in zero-dimensional space, and it just can adjust the overall level of the process factors. In the view of this problem, a segmented non-uniform dielectric module design solution is proposed for the regulation of the plasma profile in a CCP chamber. The solution achieves refined and flexible regulation of the plasma profile in the radial direction via configuring the relative permittivity and the width of each segment. In order to solve this design problem, a novel simulation-based auto-design approach is proposed, which can automatically design the positional sequence with multi independent variables to make the output target profile in the parameterized simulation model approximate the one that users preset. This approach employs an idea of quasi-closed-loop control system, and works in an iterative mode. It starts from initial values of the design variable sequences, and predicts better sequences via the feedback of the profile error between the output target profile and the expected one. It never stops until the profile error is narrowed in the preset tolerance. (C) 2014 Author(s).

Influence of Configurations of Chamber and Coil on Uniformity of Plasma Distribution for Inductively Coupled Plasma Etcher

Two-Dimensional Discharge Simulation of Inductively Coupled Plasma Etcher

Three-Dimensional Discharge Simulation of Inductively Coupled Plasma Etcher

Effect of coil and chamber structure on plasma radial uniformity in radio frequency inductively coupled plasma

Three-Dimensional Discharge Simulation of Inductively Coupled Plasma (icp) Etching Reactor

The Effect of Discharge Conditions of ICP Etching Reactor on Plasma Parameters

Gas Flow Simulation Research on Reaction Chamber of ICP Etcher

Modeling Approach and Analysis of the Structural Parameters of an Inductively Coupled Plasma Etcher Based on a Regression Orthogonal Design

Analysis of Processing Chamber Flow Field Characteristics for an ICP Etcher Based on Regression Orthogonal Design

Two-dimensional Model and Experimental Comparison of an Inductively Coupled Plasma

Fluid Model of Inductively Coupled Plasma Etcher Based on Comsol

Simulation study of an inductively coupled plasma discharge with different copper coil designs and gas compositions

Fluid Simulation of the Plasma Uniformity in New Multi-Directional Source Capacitively Coupled Plasma

Fluid simulation of the plasma uniformity in pulsed dual frequency inductively coupled plasma

Two-Dimensional Simulation of Inductively Coupled Plasma Based on Comsol and Comparison with Experimental Data

The segmented non-uniform dielectric module design for uniformity control of plasma profile in a capacitively coupled plasma chamber

Effects of induction coil parameters of plasma torch on the distribution of temperature and flow fields

Calculations of flow field and heat exchange properties in high-power high-enthalpy inductively coupled plasma generator

Parametric Study on Suspension Behavior in an Inductively Coupled Plasma

Simulation of Discharge Characteristics of Capacitively Coupled Plasma

Customized modulation on plasma uniformity by non-uniform magnetic field in capacitively coupled plasma