Abstract:Holographic exposure (i.e., exposure of a photoresist coated substrate in an interference field of two light beams), followed by development in alkaline solution and subsequent ion-beam etching, remains to be the most important technique for fabricating diffraction gratings, especially large-area gratings, despite the advance of other techniques. In this process as an intermediate product the photoresist grating serves as a mask for ion-beam etching. The shape and critical dimensions of the photoresist mask directly determine the shape and critical dimensions of the etched end product, which in turn determine the performance parameters of the grating. In a crude and yet often effective approximation the shape of the mask can be taken as rectangular and the critical dimension is duty cycle (ratio of ridge width to period). The groove depth is not critical, as long as it is large enough, and it can be controlled easily by adjusting the photoresist layer thickness during spin coating and by detecting the critical turning point of the diffraction efficiency curve of one of the grating's dispersive orders during development when the photoresist in the trough is completely removed. Once the maximum groove depth has been reached the following development process predominantly manifests as reduction of duty cycle. While the efficiency monitoring method is effective for detecting the point of trough clearing, it is ineffective for measuring duty cycle. A one-dimensionally periodic grating is an optically anisotropic structure when the groove period and light wavelength are comparable. Diffraction efficiencies of TE and TM polarizations are different and their ratio is a monotonic function of duty cycle in the range of duty cycle of interest. We propose to use this property to estimate the duty-cycle of surface-relief holographic gratings during development. We will present our theoretical simulation results and experimental results.

In-Situ Monitoring During Ion-Beam Etching of Multilayer Dielectric Gratings: Simulation and Experiment

In-situ end-point detection during ion-beam etching of multilayer dielectric gratings

In Situ Monitoring for Development of Rectangular Photoresist Gratings on Transparent Substrates

In-situ Monitoring of Metal Depositing in the Fabrication of Metallic Grating

Controlling the Duty Cycle of Photoresist Gratings by Setting the Guided-Wave Coupling Angles in Monitoring of Photoresist Development

Reactive Ion Beam Etching of Large-Aperture Multilayer Diffraction Gratings by Radio Frequency Ion Beam Source

Method for Ion Beam Etching in Angles with Multi-Layers Model

Reactive Ion Beam Etching of Multilayer Diffraction Gratings with SiO 2 As the Top Layer

Duty cycle estimate of photoresist gratings via monitoring TM/TE diffraction efficiency ratio during development.

Fabrication of echelette gratings by reactive ion beam etching of native substrate grating mask

A process study of electron beam nano-lithography and deep etching with an ICP system

Ion Beam Etching for Multilayer Dielectric Pulse Compressor Gratings with Top Layers of Hfo2

Fabrication of Self-Supporting Transmission Gratings for Plasma Diagnostics

All-dielectric High-Efficiency Reflection Gratings Made with Multilayer Thin-Film Coatings

Diffraction Efficiency Measurement of Large Aperture Multilayer Dielectric Grating and Its Application in the Fabrication Process

Finely Control Groove-Depth Variations of Large-Area Diffraction Gratings

In situ estimate of duty cycle of surface-relief holographic gratings during development by measuring TM/TE diffraction efficiency ratio

Fabrication of Slanted Grating Utilizing Reaction Ion Beam Etching: The Role of CHF<inf>3</inf> and O<inf>2</inf> Etching Atmosphere

An Optical Monitoring Method for Depositing Dielectric Layers of Arbitrary Thickness Using Reciprocal of Transmittance

Ion beam etching of large aperture diffractive optical elements

Measurement of Duty Cycles of Photoresist Grating Masks Made on Top of Multilayer Dielectric Stacks