Mechanical Design And Optimization Of Flip Chip Bonder

Chen Zhou,Yuehong Yin,Xinming Guo,Zhongqin Lin,Han Ding
DOI: https://doi.org/10.1109/AGEC.2005.1452325
2004-01-01
Abstract:A general process based on computer aided static analysis for flip chip bonder mechanical design and optimization is presented. The design of a gantry-form FC bonder structure is introduced in detail. The results of the deformation simulation and static analysis proved that the mechanical structure of FC bonder fulfilled the pre-determined requirements.
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