High-Temperature Deformation and Fracture of Free-Standing Al Thin Film

周清,王浩伟,伊藤吾朗
DOI: https://doi.org/10.3321/j.issn:1006-2467.2004.02.038
2004-01-01
Abstract:Creep tests of free-standing aluminum thin film with thickness range 7~500 μm were carried out at high temperature and constant load. The relationship between the creep rate and the thickness and grain size was studied. The creep parameters were located on the deformation mechanism map and the creep mechanism was discussed. The fracture surface was observed with SEM and the creep rate dependence of the fracture time was obtained. It is shown that the creep rate of the free-standing thin film is dependent on the thickness and the grain size greatly when h/d1 and the characteristics differ from that of the bulk material.
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