Deformation behavior and microstructure evolution of 7050 aluminum alloy during high temperature deformation

H.E. Hu,L. Zhen,L. Yang,W.Z. Shao,B.Y. Zhang
DOI: https://doi.org/10.1016/j.msea.2007.10.051
2008-08-01
Abstract:Deformation behavior and microstructure evolution of 7050 aluminum alloy were investigated by tensile tests conducted at different temperatures (340, 380, 420, and 460°C) with different strain rates of 1.0×10−4, 1.0×10−3, 1.0×10−2 and 0.1s−1. The results show that the stress level of the alloy can be presented by a Zener–Holloman parameter in a hyperbolic sine-type equation with the hot activation energy of 256.6kJ/mol. Ductile transgranular fracture transforms progressively into ductile intergranular (or inter-subgranular) fracture with the decrease of Z value. At the same time, the soften mechanism of the alloy during high temperature deformation transforms from dynamic recovery to continuous dynamic recrystallization with decreasing Z value. The main deformation mechanism is usual slipping when the alloy was deformed at high Z value. Grain boundaries sliding takes part in deformation with low Z value. Grain boundaries migration plays the role with medium Z value.
What problem does this paper attempt to address?