Simulation study of deposition under two types of impinging trajectories

Xiuqin Wei,lihua zhou
2004-01-01
Acta Metallurgica Sinica (English Letters)
Abstract:A model coupling particle aggregation and randomwalk surface diffusion is developed for 2D simulation of depositional growth, in which impinging particles follow either a straight-line trajectory of cosine distribution, representing typically sputter deposition, or a scattered trajectory, representing typically electrochemical deposition. Simulations of the growth under various impinging conditions and effective surface diffusivity are carried out. Pattern and defect development in deposition on fiat, trenched and ridged substrates are investigated. It is found that on flat and rigid substrates, both types of trajectories yield similar features, including formation of cone-like defects on surface ridges. While on trenched substrate, the straight-line impingement yielded more uniform step coverage than the scattered impingement.
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