Ag and Cu Whisker Formation in Ag–Cu–Te Alloys
Sinn-wen Chen,Pin-shuo Huang,Yung-Chun Tsai,Yohanes Hutabalian,Jhe-Yu Lin
DOI: https://doi.org/10.1007/s10853-024-09714-1
IF: 4.5
2024-01-01
Journal of Materials Science
Abstract:Long Ag and Cu whiskers are found in Ag–Cu–Te alloys annealed at 400 and 600 °C. Depending upon the nominal compositions of the alloys, there are three kinds of whiskers, Ag, Cu, and Ag + Cu whiskers. For the first time, two different kinds of whiskers grown simultaneously from the same substrate are observed. These whiskers are all polycrystalline, and the grain sizes of the Ag are larger than those of Cu. As indicated by their continuous connection with the substrate, many shear bands in the whiskers, and low-angle grain boundaries piling up near the grain boundaries, it is confirmed that the whiskers grow not from the gas phase, but within the solid state, pushed outward by stress. The Ag–Cu–Te liquidus projection is calculated by the Calphad method. It is found that the compositional regimes of whisker growth overlap with the regions of the liquid miscibility gaps. When alloys solidify through a liquid miscibility gap, two regions of different compositions would form. The stress developed following solidification, originating from these two regions of different compositions, is the main driving force behind whisker formation. The rapid growth rates of the whiskers are a result of the rapid liquid-like diffusion behaviors of the Ag and Cu atoms in the Ag–Cu–Te alloys of the cage-like structures.