Diffusion bonding of Al alloy to Al2O3 ceramic

Jicai Feng,DaYong Wang,Zhuoran Li,Huijie Liu
IF: 3.752
2003-01-01
Transactions of Nonferrous Metals Society of China
Abstract:A layer of Cu was sintered on the surface of Al2O3 ceramic before bonding, and then diffusion bonding technology was applied to bond Al2O3/CU to Al alloy. SEM and EDS were applied to analyze the interfacial microstructures of Al2O3/Cu/Al joint. The preliminary research shows that Al/Cu interfacial microstructures are the main factor affecting joint strength. With increasing bonding temperature and time, ( (Al) + theta) mixture separates out from Al alloy, and (Cu) + gamma(1))mixture separates out from Cu layer. The two kinds of mixtures develop first along interface, then (Cu)+gamma(1)) microstructure turns progressively into (xi(2) + delta) with bonding temperature and time prolonged. At the same time, (Al) + theta) and (xi(2) + delta) phases move gradually into base materials. The two kinds of changes result in reducing bonding strength greatly. The optimum diffusion bonding parameters are determined as follows: T=773 K, t=1226 s and p=6 MPa, at which the tensile strength of the joint is,108 MPa, and the shear strength of the joint is 45 MPa.
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