Effect of Ni, Mn, Si and Ti on mechanical and electronic properties of copper alloy

张秀群,孙扬善,薛烽,闵学刚,杜飞
DOI: https://doi.org/10.3321/j.issn:1001-0505.2003.04.019
2003-01-01
Abstract:Microstructure, mechanical properties and electrical conductivity of copper based alloys with additions of Ni/Si, Mn/NiSi, and Ti have been investigated by optical microscope and scanning electron microscope. It is found that the microstructure stability of the alloys increases when Ti, Ni and Si is added, while the addition of Mn, Ni and Si can not restrict the growth of the matrix grains at elevated temperatures. The strength of alloy increases remarkably with Ti, Ni and Si additions and it reaches 907 MPa when 6%Ni and 1.42% Si are added. The electrical conductivity of the alloy deceases with the Ni/Si addition but it still remains at a high level. Additions of Mn, Ni and Si do not result in the increase of strength, meanwhile the electrical conductivity decreases significantly.
What problem does this paper attempt to address?