Preparation of Au (Core)-Cu (shell) Nanoparticles Assembly by Electrodeposition

LY Cao,P Diao,ZF Liu
DOI: https://doi.org/10.3866/pku.whxb20021202
2002-01-01
Abstract:Submonolayer assembly of Au (core)-Cu (shell) nanoparticles was prepared by electrodeposition of Cu on Au nanoparticles assembly electrode, where AUDT + DT mixed monolayer was used as the coupling layer between gold substrate and Au nanoparticles. Under suitable polarized potential, Cu was found to be selectively electrodeposited on Au nanoparticles rather than on the organic monolayer. At - 0.03 V, An (core)-Cu (shell) nanoparticles have good monodispersity and spherical shape until their diameters exceeded 20 nm, and the diameters of which are in good accordance with those calculated by coulometry.
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