Shear Stress Distribution in Fillet of Al-Al2O3 Soldering Assembly and Thermal Expansion Matching

马鑫,冯吉才,董占贵,梁旭文

DOI: https://doi.org/10.3321/j.issn:1004-0609.2001.05.003

2001-01-01

The Chinese Journal of Nonferrous Metals

Abstract:By means of finite element numerical simulation, the shear stress distribution in the fillet of Al Al 2O 3 soldering assembly was analyzed. The calculating results show that the maximum level of shear stress occurrs at the soldering fillet and the interface near the soldering fillet between Al 2O 3 ceramics and coated Cu. Meanwhile, in order to limit the shear stress as small as possible, the thermal expansion coefficient of interlayer alloy should match with the Al base metal.