Abstract:Scanning electron microscopy (SEM) enables microstructure characterization at multi-scale, having potential to quantify strain distribution across multiple fields of view (FOVs) and exploring coordinated relationships among the deformations of multi-scale microstructures. Optimizing distribution of multi-scale speckles is crucial for achieving high precision and efficiency in digital image correlation (DIC) computations. In this work, a multi-scale strain measurement method is proposed for in-situ SEM mechanical experiments, which relies on an uncomplicated multi-scale speckle preparation method. Multi-scale speckle preparation can be achieved by the combination of spin-coating and magnetron sputtering. By using micro- and macro-speckle, multi-scale strain calculations can be achieved during the in-situ SEM mechanical loading. The InSn macro-speckle is composed of controllable-sized InSn nanoscale speckles, ensuring that the accuracy of DIC measurements in the microscopic regions are not compromised by the coverage of macro-speckles in the testing region. In regions covered exclusively by SiO2 nano-speckles, in-situ SEM mechanical loading allows for the acquisition of high-resolution DIC (HR-DIC) and electron backscatter diffraction (EBSD) data from the same region and under the same deformation state. Experiments are conducted to illustrate the functionality and utility of the multi-scale speckles. Such experimental analyses offer an opportunity to further explore multi-scale strain heterogeneity in some advanced structural materials and provide reliable experimental verification for material mechanics simulations.

Large deformation and mechanical behavior analysis using temporal speckle pattern interferometry

On the Propagation and Pulsation of Portevin-Le Chatelier Deformation Bands: an Experimental Study with Digital Speckle Pattern Metrology

Study of Ballistite Material Mechanical Behaviors Using Temporal Speckle Pattern Interferometry

Continual deformation analysis with scanning phase method and time sequence phase method in temporal speckle pattern interferometry

High-Precision Large Deflection Measurements of Thin Films Using Time Sequence Speckle Pattern Interferometry

Deformation Measurement of A Small Component and A Thin Film Using Time Sequence Speckle Pattern Interferometry

Deformation analysis with temporal speckle pattern interferometry

Investigation on Mechanism of Plastic Deformation by Digital Speckle Pattern Interferometry

Visualization of Formation and Propagation of Local Deformation Slip-Band of Metal Material with Speckle Interferometry Method

Surface Patterning for Multi-Scale Strain Analysis of In-Situ Sem Mechanical Experiments

Investigation of Slipband Propagation in Aluminum Alloy with Dynamic Speckle Interferometry

Full field and microregion deformation measurement of thin films using electronic speckle pattern interferometry and array microindentation marker method

In Situ and Real-Time Tensile Testing of Thin Films Using Double-Field-of-view Electronic Speckle Pattern Interferometry

Synchronous in-situ measurement for deformation and temperature fields with high spatial and temporal resolution under dynamic loading

Optical Full-Field Technique for Measuring Deformation on Micromechanical Components

Investigation of Kinematics of the Portevin-Le-Chatelier Deformation Bands with Dynamic Digital Speckle Pattern Interferometry

Speckle Interferometry to Investigate Degradation Processes of Stressed Solid Materials

Dynamic deformation measurement with 2-frame phase-shifting speckle interferometry based on speckle statistics and wavefront multiplexing

Study of Propagation and Pulsation of Slip Band Using Dynamic Digital Speckle Pattern Interferometry

Digital Speckle Pattern Interferometry for Observing the Entire Process of Plastic Deformation of a Solid Object

Dynamic Observation of Localized Strain Pulsation Generated in the Plastic Deformation Process by Electronic Speckle Pattern Interferometry