Implantation Dynamics of Plasma Immersion Ion Implantation into Non-Conductive Materials and Applications
Fu, R.K.Y.,Tian, X.B.,Chu, P.K.
DOI: https://doi.org/10.1109/plasma.2004.1339857
2004-01-01
Abstract:Summary form only given. Non-conductive materials such as dielectrics, polymers and ceramics are widely used in the industry. Many techniques have been developed to enhance the surface properties and extend the applications of these materials. The use of plasma immersion ion implantation (PIII) on non-conductive materials is investigated via theoretical and experimental means. Computer simulation is utilized to model the implantation dynamics of the plasma sheath, surface potential, surface charge distribution, ion implant dose, implant uniformity, and other parameters and factors during PIII of insulators. Systematic experiments is also conducted to evaluate the effects of various plasma parameters and placement configurations on the sample properties and implantation efficacy. Our results show that in general, a low plasma density and short-pulse mode are preferred as there is less surface charging, a smaller potential drop on the sample surface, and a thinner plasma sheath. Based on findings in our studies, gases and metals have been implanted into some non-conductive materials to improve their surface energy, conductivity, mechanical and tribological properties. These empirical results is presented as well.