Resistance of alumina-copper composite to thermal shock

Lin Wang,Jianlin Shi,Dongsheng Yan
DOI: https://doi.org/10.2109/jcersj.108.1264_1115
2000-01-01
Journal of the Ceramic Society of Japan
Abstract:The present work is concerned with the thermal shock behavior of a ceramic matrix composite consisting of an alumina base containing 5 vol% of copper particles. The composite, hot-pressed at 1550 degreesC, exhibited increased flexural strength, enhanced toughness and higher resistance to thermal shock compared with monolithic alumina. Some mechanical and thermal properties relevant to thermal shock were discussed which gave plausible explanations for the differences between the composite and the monolithic alumina.
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