A Novel Al–Cu Composite with Ultra‐High Strength at 350 °C via Dual‐Phase Particle Reinforced Submicron‐Structure

Kewei Xie,Jinfeng Nie,Chang Liu,Wenhao Cha,Ge Wu,Xiangfa Liu,Sida Liu
DOI: https://doi.org/10.1002/advs.202207208
IF: 15.1
2023-07-13
Advanced Science
Abstract:An ultra‐strong and heat‐resistant Al‐Cu composite is fabricated, showing a structure of nano‐AlN and submicron‐Al2O3 particles uniformly distributed in the matrix. The deformation mechanism at elevated temperatures is studied, which reveals that grain boundary sliding is suppressed and dislocation multiplication is favored due to the pinning effect by nano‐AlN particles and Guinier–Preston zones. Thermal stability determines a material's ability to maintain its performance at desired service temperatures. This is especially important for aluminum (Al) alloys, which are widely used in the commercial sector. Herein, an ultra‐strong and heat‐resistant Al‐Cu composite is fabricated with a structure of nano‐AlN and submicron‐Al2O3 particles uniformly distributed in the matrix. At 350 °C, the (8.2AlN+1Al2O3)p/Al‐0.9Cu composite achieves a high strength of 187 MPa along with a 4.6% ductility under tension. The high strength and good ductility benefit from strong pinning effect on dislocation motion and grain boundary sliding by uniform dispersion of nano‐AlN particles, in conjunction with the precipitation of Guinier–Preston (GP) zones, enhancing strain hardening capacity during plastic deformation. This work can expand the selection of Al–Cu composites for potential applications at service temperatures as high as ≈350 °C.
materials science, multidisciplinary,nanoscience & nanotechnology,chemistry
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