Laser three-dimensional measuring technique by cutting layer

Yaping Ren,Mingtao Zhao,Linyang Wng,Yushan Tan,Yuxiao Yang
1997-01-01
Abstract:An optoelectronic measuring technique used for laser rapid prototype systems in reverse engineering is introduced. In this technique, the accurate measurement of the inside and outside shapes of the three-dimensional object can be achieved by layer-by-layer cutting of the object. This measuring technique has the advantages of (1) outside and inside of the object can be measured simultaneously with same accuracy; (2) the measuring accuracy is higher than the ordinary optoelectronic measuring method owing to the high resolution scanning device and numerical control vertical layer cutting machine are used; (3) the material to be measured is unrestricted.
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