Abstract:Dendrite growth velocity as a function of initial bulk undercooling was systematically studied in situ using high speed thermal imaging of highly undercooled Ni90Cu10 and Ni95Cu5 single phase alloy melts. For these two non-dilute concentrated alloys, the dendrite growth velocity first increased continuously at small and mediate undercooling regimes and then discontinuously to a maximum value at the high undercooling range. A clear plateau appeared in the growth velocity-undercooling curve revealed a gradual transition from mainly solute-controlled growth to mainly thermal-controlled growth, which was very similar to the solidification characteristics of a dilute alloy. The discontinuity appeared in the growth velocity-undercooling relationship was suggested to be induced by the finite solute diffusion speed in the bulk melt ahead of the advancing solid-liquid interface. Microstructure, substructure and microtexture of the two undercooled alloys were characterized using EBSD technique, and the fundamental mechanism behind “spontaneous grain refinement” is elucidated. The microstructure evolution indicated two kinds of grain refinements: one was dendrite remelting induced grain refinement and the other was recrystallization induced grain refinement. It was found that the texture of the as-solidified microstructure was getting more and more random as the initial bulk undercooling increased, which was due to the increased stress and recrystallization in the as-solidified microstructure. New evidence of grain refinement was found in the as-solidified samples. We found that the samples undercooled beyond the critical undercooling had a grain refined microstructure and that this corresponded with a clear discontinuity in the dendrite growth velocity-undercooling curve. Microstructural data suggested that in Ni-Cu alloys grain refinement at a high undercooling was a consequence of a recrystallization process, which contrasted with conventional grain refined alloys where grain refinement appeared to be the result of remelting-induced dendritic fragmentation.

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Analysis on Microstructure of Al-40%Cu Alloy in Directional Solidification Process

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Orientation Evolution of Al-Al <sub>2</sub>Cu Regular Eutectic Lamellar Bifurcating at an Abruptly Changing

Microstructure Evolution and Property Changes of Al-Si-Cu Alloy by Controlling Directional Solidification Parameters

Numerical Simulation of Microstructure Evolution During Directional Solidification of Ti-45at. % Al Alloy