Growth of Ω Plates and Its Effect on Mechanical Properties in Al-Cu-Mg-Ag Alloy with High Content of Silver

Yanxia Gu,Zhiyi Liu,Dier Yu,Bingbin Liu,Mao Lin,Sumin Zeng
DOI: https://doi.org/10.1007/s11665-013-0472-8
IF: 2.3
2013-01-01
Journal of Materials Engineering and Performance
Abstract:In this study, the effects of thermal exposure at 200 A degrees C on the mechanical properties and the growth of Omega plates in an Al-Cu-Mg-Ag alloy with high content of silver were investigated. It was shown that the tensile strength of the exposed alloy decreased with the increase of the mean lengths of Omega precipitates and the decrease in the volume fraction of the Omega phase. The decrease in tensile strength of the 165 A degrees C/14-h-aged samples was less significant than that of 165 A degrees C/2-h-aged samples because the lengthening rate of Omega plates was lower and the number density of Omega precipitates was higher in the 165 A degrees C/14 h-aged samples. The thickening rate of Omega plates was very low during exposure at 200 A degrees C because of high content of silver, and the growth behavior was caused mainly by the lengthening of Omega plates within the habit plane. High content of silver inhibited the thickening of Omega plates and promoted the lengthening of Omega precipitates during exposure.
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