Transient Pull-In Analysis of Micro-Plate with Fluid-Structure Interactions

X. Z. Lin,J. Ying,J. M. Huang

DOI: https://doi.org/10.4028/www.scientific.net/kem.562-565.637

2013-01-01

Key Engineering Materials

Abstract:Electrostatic micro-devices are simple but important for MEMS applications. Precise dynamic descriptions of these devices are often hard to obtain due to the electrostatic nonlinearity and the fluid-structure interactions in devices. Here we present a comprehensive electrostatic-mechanical- fluidic coupling transient analysis for the pull-in process of two ends fixed micro-plate device. The numerical results are compared with the published experiment works of other researchers available in the literature, and thus the model had been validated. After that the proper orthogonal decomposition approach is performed for the snapshot matrixes which are sampled from an ensemble of the fully finite element results. The resulted spatial distribution modes of pressure show a higher spatial frequency toward the middle of the micro-plate, which indicates that the pressures at the moving edges of the plate are not equal to ambient pressure. Due to the increasing demands for simulation accuracy, the electrostatic-mechanical interactions and the nonlinear features of viscous loss from the surrounding fluid have to be taken into account in details.