Abstract:Microelectromechanical systems (MEMS) have become increasingly prevalent in engineering applications. In these MEMS, a lot of micro-components, such as thin films, nanowires, micro-beams and micropillars, are utilized. The characteristic geometrical size of those components is at the same scale as that of grain, the mechanical behavior of crystal materials exhibits significant size effect and discontinuous deformation. In addition, those MEMS are often subjected to high strain rate at work, such collision and impact loading. The coupling deformation characteristics of small scale crystals and high strain rate makes their mechanical behavior more complicated. Accordingly, investigation of the effect of the strain rate on crystal materials at micron scale is significant for both the academia and industry. In this work, a plastic deformation model of fcc crystal under axial compression was developed based on three-dimensional discrete dislocation dynamics (3D-DDD), which considered the influence of externally applied stress, interaction force between dislocation segments, dislocation line tension and image force from free surface on dislocation movement during the process of plastic deformation. It was applied to simulate the plastic deformation process of a Ni single crystal micropillar during compression under different loading strain rates. 3D-DDD and theoretical analysis are carried out to extensively investigate the effect of strain rate on flow stress and deformation mechanisms during plastic deformation process of crystal materials. The results show that the flow stress and the dislocation density increased with the loading strain rate. In the case of low strain rate, the flow stress was dominated by the activation stress of FreakRead (FR) source in plastic deformation. With the increase of strain rate, the contribution of activation stress of FR source to the flow stress decreases and the effective stress gradually dominated the flow stress. Under high strain rate loading, with the increase of the initial FR source, the dislocation density also increased at the same strain correspondingly, which makes it easier to meet the requirement of the loading strain rate, so the flow stress is smaller. In addition, under the low strain rate loading, a few activated FR sources can meet the requirement of the plastic deformation, a single slip deformation come up as a result. While, as the loading strain rate increases, more and more activated FR sources would be needed to coordinate the plastic deformation, the deformation mechanisms of the single crystal micropillar transformed from single slip to multiple slip.

Strain Rate Effects on the Mechanical Response in Multi- and Single-Crystalline Cu Micropillars: Grain Boundary Effects

Comparisons Between Homogeneous Boundaries and Heterophase Interfaces in Plastic Deformation: Nanostructured Cu Micropillars Vs. Nanolayered Cu-based Micropillars

Emergence of external size effects in the bulk-scale polycrystal to small-scale single-crystal transition: A maximum in the strength and strain-rate sensitivity of multicrystalline Cu micropillars

Grain boundary effects on the inelastic deformation behavior of bicrystals

Strain rate sensitivity of nanolayered Cu/X (X=Cr, Zr) micropillars: Effects of heterophase interface/twin boundary

Influence of grain boundary activites on elastic and plastic deformation of nanocrystalline Cu as studied by phase filed and atomistic simulaiton

An investigation of the combined size and rate effects on the mechanical responses of FCC metals

Investigation of Strain Rate Effect by Three-Dimensional Discrete Dislocation Dynamics for Fcc Single Crystal During Compression Process

Strain Rate Effects on the Plastic Flow in Submicron Copper Pillars: Considering the Influence of Sample Size and Dislocation Nucleation

A fundamental understanding of how dislocation densities affect strain hardening behavior in copper single crystalline micropillars

Quantifying the influence of grain boundary activities on Hall-Petch relation in nanocrystalline Cu by using phase field and atomistic simulations

Effect of grain boundary deformation on mechanical properties in nanocrystalline Cu film investigated by using phase field and molecular dynamics simulation methods

Influences of Symmetric Tilt Grain Boundary on the Stretching Deformation Behaviors of Cu Bicrystals

Dependence of strain rate sensitivity upon deformed microstructures in nanocrystalline Cu

Stepwise work hardening induced by individual grain boundary in Cu bicrystal micropillars

Strain rate sensitivity of Cu/Ta multilayered films: Comparison between grain boundary and heterophase interface

Plastic strain-induced grain refinement at the nanometer scale in copper

Mechanical properties and deformation mechanisms of single crystal Mg micropillars subjected to high-strain-rate C-axis compression

Strain-rate and size dependence of gradient lamellar nickel investigated by in-situ micropillar compression

Size-Dependent Deformation Mechanisms and Strain-Rate Sensitivity in Nanostructured Cu/X (X = Cr, Zr) Multilayer Films

Grain Boundary Orientation Effects on Deformation of Ta Bicrystal Nanopillars under High Strain-Rate Compression