Heat Transfer Enhancement in Mini-Channel Heat Sinks with Dimples and Cylindrical Grooves

C. Bi,G. H. Tang,W. Q. Tao

DOI: https://doi.org/10.1016/j.applthermaleng.2013.03.007

IF: 6.4

2013-01-01

Applied Thermal Engineering

Abstract:The convective cooling heat transfer in mini-channels with dimples, cylindrical grooves and low fins is numerically studied by using the field synergy principle. We solve the synergy angle distribution to examine the mechanisms of the heat transfer enhancement in the enhanced surfaces. The parameter PEC as the evaluation coefficient is employed to study the comprehensive performance of the enhanced surfaces. The results show that the dimple surface presents the highest performance of heat transfer enhancement. The geometry size effects of dimple are studied over a Reynolds number range of 2700–6100, and the most favorable dimple geometric structures are optimized by using the performance evaluation plot of enhanced heat transfer techniques.