Abstract:Immersion lithography seeks to extend the resolution of optical lithography by filling the gap between the final optical element and the wafer with a liquid characterized by a high index of refraction. The semiconductor industry demands high throughput, leading to relatively large wafer scanning velocities and accelerations. For higher scanning velocities, an issue that has been identified is the deposition of the immersion liquid while confining a relatively small amount of liquid to the under-lens region. Liquid loss occurs at the receding contact line that forms when a substrate is withdrawn from a liquid, which potentially leads to defects on printed patterns. There has been substantial prior work relative to understanding and building semi-empirical correlations and numerical models to investigate this behavior of the receding three-phase contact line. In the current work, a new liquid injection and collection model with analytic solutions is presented and compared with experimental results, in which the critical velocity for liquid loss is mainly a function of the vacuum degree, the injection flow rate, the properties of the immersion liquid. This correlation allows the critical velocity to be predicted with a given gap height between wafer and lens using only a measurement of the injection speed and knowledge of the fluid properties. Experimentally, glycerin-water mixtures of varying viscosities and different injection flow rates were tested, with variable outlet vacuum degree and inlet speed, showing a mean average error within 12%. This correlation represents a useful tool that can serve to approximately guide the development of fluid control for immersion systems as well as to evaluate alternative immersion fluid candidates to minimize liquid deposition while maximizing throughput.

Reverse Nonequilibrium Molecular Dynamics Calculation of the Resist Shear Viscosity in Uv-Nanoimprint Lithography

Effects of Mold Geometries and Initial Resist Thickness on Filling Behavior in UV-Nanoimprint Lithography

Study on Rheological Mechanism of Polymer Used in Nano-imprint Lithography

Numerical Investigation for the Resin Filling Behavior during Ultraviolet Nanoimprint Lithography of Subwavelength Moth-Eye Nanostructure

Numerical Simulation and Experimental Study on Resist Filling Behavior in UV-nanoimprint Lithography

Investigation of Resist Filling Behavior in Microimprint Lithography by Computational Fluid Dynamics Simulation and Defocusing Digital Particle Image Velocimetry

Resist deformation and flow fields in microimprint lithography

Molecular Dynamics Calculation of Resist Deformation Behavior in Nanoimprint

Simulation Of The Velocity Distribution For Immersion Lithography

Hydrodynamic and Solid Mechanics Analysis of Capillary Force-Induced Mold Deformation in Sub-10 nm UV Nanoimprint Lithography

Axisymmetric thermo-mechanical analysis of laser-driven non-contact transfer printing

Film Thickness Control of Resist on Nanoimprint Lithography

Effect of Resin Accumulation on Filling Process in Roll-To-Roll Uv Imprint Lithography

Investigation on the critical velocity for liquid loss in immersion lithography

An Accurate Thermomechanical Model for Laser-Driven Microtransfer Printing

Effects of Exposure Time on Defects and Demolding Force in Soft Ultraviolet Nanoimprint Lithography

Molecular Dynamics of Polymer's Interface Behaviour in the Nanoimprint Lithography

Viscous Dissipation Effect in Nano-Confined Shear Flows: a Comparative Study Between Molecular Dynamics and Multi-Scale Hybrid Simulations

Hydrodynamics and solid mechanics structural analysis of mold deformation in nanoimprint lithography

Investigation of resist filling profile evolution in microimprint lithography

Visualization of resist flow fields in microlithography by using defocusing digital particle image velocimetry