Abstract:A novel bisphenol(1,2-dihydro-2-(4-((4-hydroxy)phenyliminomethylidene)phenyl)-4-(4-((4-(4-hydroxy)phenyliminomethylidene)phenoxy)phenyl)(2H)phthalazin-1-one, DPP) and a diamine(1,2-dihydro-2-(4-aminophenyl)-4-(4-(4-aminophenoxy)phenyl)(2H)phthalazin-1-one, DAP) were synthesized and characterized. The novel epoxy polymers containing phthalazinone and/or azomethine moieties were prepared by binary polymerization of DAP (or DPP) with diglycidyl ether of biphenyl A (DGEBA) and ternary polymerization of hybrid curing agents, DAP/DPP (DAP and DPP under different molar ratios) with DGEBA. The cure behaviors of these new epoxy systems were studied by dynamic differential scanning calorimeter (DSC) and Infrared (IR) scans. Especially, the activation energy of DAP/DGEBA calculated by Kissinger and Ozawa methods were 73.8 and 77.4 kJ/mol, respectively. For ternary epoxy system, it was found that hybrid curing agents of DAP/DPP exhibited significant associated effect on their reactivity towards the oxirane group. Glass transition temperatures (Tg's) of these new epoxy polymers were all above 150 °C from the results of DSC, and the initial thermal decomposition temperatures (Td,5%'s) and integral procedure decomposition temperatures (IPDT's) of these new epoxy polymers are above 350 and 850 °C, respectively from results of thermogravimetric analyses (TGA). These results show that new epoxy polymers containing phthalazinone and/or azomethine moieties exhibited excellent thermal properties. Especially, thermal properties of the ternary epoxy polymers could be modified by changing the content of DAP and DPP. The linear relationships between char yield (Yc,wt%) and the structural compositions of these new polymers (weight percentage of phthalazinone, azomethine and nitrogen, C/H weight ratio) were built.

Cure Mechanism and Thermal Properties of the Phthalide-Containing Bismaleimide/Epoxy System

Study on Curing Kinetics and Thermal Properties of Bismaleimide Resin Containing Ether Linkage

Thermal properties of an epoxy cresol-formaldehyde novolac/diaminodiphenyl sulfone system modified by bismaleimide containing tetramethylbiphenyl and aromatic ether structures

Curing Behavior of the Bismaleimide Containing Ether Linkage and Naphthalene

STUDY ON DGE-BHBTMBP/E-51/DDS CURED

Studies on Cure Kinetics of Diglycidyl Ether of 4,4′-Bisphenol/4,4′-diaminobiphenyl Using the Advanced Isoconversional Method

Cure Kinetics of an Epoxy Resin Containing Naphthyl/dicyclopentadiene Moieties and Bis‐phenoxy (3‐hydroxy) Phosphine Oxide System and Properties of Its Cured Polymer

Studies on the Phase Separation of Poly(Ether Imide)‐Modified Cyanate Ester Resin

Synthesis and Curing of a Novel Combined Liquid Crystalline Epoxy

Synthesis and Characterization of a Novel Heat Resistant Epoxy Resin Based on N,N′-bis(5-hydroxy-1-naphthyl)pyromellitic Diimide

Evaluating a Four-Directional Benzene-Centered Aliphatic Polyamine Curing Agent for Epoxy Resins

Investigation on the Curing and Thermal Properties of Epoxy/Amine/Phthalonitrile Blend

Cure Kinetics and Thermal Properties of Tetramethylbiphenyl Epoxy Resin/phthalazinone‐containing Diamine/hexa(phenoxy)cyclotriphophazene System

Synthesis of Novel Bisphenol Containing Phthalazinone and Azomethine Moieties and Thermal Properties of Cured Diamine/Bisphenol/Dgeba Polymers

Curing Degree Dependence of Dielectric Properties of Bisphenol-A-Based Epoxy Resin Cured With Methyl Hexahydrophthalic Anhydride

The Effect of Bismaleimide on Thermal, Mechanical, and Dielectric Properties of Allyl-Functional Bisphthalonitrile/bismaleimide System

Reaction Kinetics, Thermal Properties of Tetramethyl Biphenyl Epoxy Resin Cured with Aromatic Diamine

Study of novel heat resistant BMI modified epoxy resin

Hierarchical Curing Mechanism in Epoxy/bismaleimide Composites: Enhancing Mechanical Properties Without Compromising Thermal Stabilities

Curing kinetics and thermal properties of [2,2] paracyclophane/bisphthalonitrile-terminated imide resins

Preparation And Characterization Of Novel Bismaleimide Resins Modified With Diallyl Bisphenol A