Fracture analysis of an interfacial crack in a piezoelectric smart beam

Ruixiang BAI,Liang WANG,Haoran CHEN
DOI: https://doi.org/10.3969/j.issn.1006-7043.201212002
2013-01-01
Abstract:The stress analysis and fracture behavior on the basis of the energy principle for an interfacial crack in a piezoelectric smart beam was studied in theory. Based on the Timoshenko beam theory, an analytical model was de-veloped for the piezoelectric smart beam with consideration to the adhesive layer, in which the adhesive layer was modeled as a continuous spring with the shear and peel stiffness, the governing equations for the piezoelectric smart beam were formulated firstly, and then analytical solutions were obtained for calculating interfacial peel stressσand shear stress τ and mode I and II energy release rates (EERs) GI and GI I, respectively. The present solutions were verified by experiment results and those available in the literatures. The results indicated that the values of the peel stress of the crack tip and the shear stress are in the same order of magnitude, and the mode I fracture cannot be ig-nored for the prediction of interfacial fracture behavior in the piezoelectric smart beam.
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