Nanostructured Bi2-Xcuxs3 Bulk Materials With Enhanced Thermoelectric Performance

Zhen-Hua Ge,Bo-Ping Zhang,Yong Liu,Jing-Feng Li
DOI: https://doi.org/10.1039/c2cp23955h
2012-01-01
Abstract:Nanostructured Bi2-xCuxS3 (x = 0, 0.002, 0.005, 0.007, 0.01, 0.03) thermoelectric polycrystals were fabricated by combining mechanical alloying (MA) and spark plasma sintering (SPS) methods. The effect of Cu content on the microstructure and thermoelectric property of Bi2-xCuxS3 bulk samples was investigated. It was found that the subtle tailoring of Cu content could reduce both the electrical resistivity and the thermal conductivity at the same time, and consequently enhancing the thermoelectric property. A low electrical resistivity of 1.34 x 10(-4) Omega m(-1) and a low thermal conductivity of 0.52 W m(-1) K-1 were obtained for the Bi1.995Cu0.005S3 sample at 573 K. The low thermal conductivity is supposed to be due to the nanoscopic Cu-rich regions embedded in the host matrix. A peak ZT value of 0.34 at 573 K was achieved for the Bi1.995Cu0.005S3 composition, which is the highest value in the Bi2S3 system reported so far.
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