Thermal Conductivity of Nanoporous Gold Microwires at Different Annealing Temperatures

WANG Jian-li,LI Sheng,XIA Re,ZHANG Xing,CHEN Yun-fei

DOI: https://doi.org/10.3969/j.issn.1672-6030.2012.01.007

2012-01-01

Nanotechnology and Precision Engineering

Abstract:The thermal conductivity of nanoporous gold microwires was measured using T type probe method.A reduction in thermal conductivity was observed as annealing temperature increases.Taking the effect of porosity and ligament diameter into consideration,the thermal conductivity calculated by the conventional models will be larger than the experimental results.The morphological analysis shows that ligament coarsens during the annealing process,and the tensile stress in ligament is expected to increase with the increase of annealing temperature.The present result can be possibly explained by the defects in nanostructures ascribed to the tensile stress,which will cause the electron collisions to reduce the thermal conductivity in nanoporous materials.