High-precision silver electrode based on PEN substrate with robust mechanical performance
Mingyue Hou,Xiaoqin Wei,Rihui Yao,Yucheng Huang,Rui Zhou,Kangping Zhang,Bocheng Jiang,Zihan Zhang,Honglong Ning,Junbiao Peng
DOI: https://doi.org/10.1016/j.surfin.2024.105158
IF: 6.2
2024-10-09
Surfaces and Interfaces
Abstract:Wearable electronics are becoming more and more popular, and in order to ensure the safety and accuracy of wearable electronics, the requirements for the refinement and stability of flexible electrodes are getting higher and higher. The reduction of the amount of ink jet and the reduction of surface charge density and electrostatic stress near the nozzle hole can significantly improve the jetting state of the ink. And nozzle voltage is a key factor that affects them. The spreading of ink droplets on the substrate and the formation of a specific pattern is a dynamic process, which is closely related to the properties of the substrate and the state of the ink droplets. In this paper, PEN is used as the substrate to print silver electrode, with its good thermal stability and good mechanical properties. In order to solve these problems and improve the accuracy of the electrode pattern on PEN substrate, a joint control method of ink drop spacing and nozzle voltage is proposed. It is found that the accuracy of the pattern increases with the increase of the drop spacing. At 45 μm, 90.91 % of the pattern accuracy with the ideal pattern can be achieved. As the nozzle voltage decreases, so does the satellite spot. And at 25 V, it can achieve satellite-free spot printing. Because this method avoids the adjustment of ink properties and the regulation of voltage waveform, this advancement provides a simpler solution for patterned high-precision printed silver electrodes based on flexible substrates. In addition, a silver electrode with a resistivity of 3.43 μΩ·cm was obtained at an annealing temperature of 160 °C. The resistivity change of the electrode only 7.58 % under 5000 times of bending. This is very rare in flexible electrodes.The silver film on the PEN substrate exhibited excellent adhesion under the tape test. XPS depth profiling was used to characterize the elemental states of the films at different depths. The results indicated that the coordination bond between the PEN substrate and the Ag film resulted in good bending resistance, which gives a persuasive explanation for the first time. This result is also due to the precise handling of the film, which also results in a homogeneous distribution of the film. It solves the problem of poor adhesion of silver electrodes based on other substrates or other preparation methods. Therefore, silver electrodes based on PEN substrates have a broad application prospect in the field of flexible wearable electronics.
chemistry, physical,physics, applied, condensed matter,materials science, coatings & films