Abstract:We show how a rigid patterned SU-8 thin film in tandem with the mechanical Poisson effect can be used beneficially to enable robust metallization on stretchable polydimethylsiloxane (PDMS). Two generic planar processes used to form a thin, mechanically-robust strain-shielding photoresist on a soft substrate are developed to demonstrate these ideas. The first process is a self-aligned metallization of photolithographically patterned SU-8 features on PDMS. The second process is a fully photolithographic lift-off metallization of pre-patterned SU-8 features on PDMS. In both cases, the SU-8 has a sub-micrometre thickness (~800 nm)—supporting a thermally evaporated Ti/Au (5 nm/50 nm) thin film metallization. The resulting samples were characterized electromechanically—the results demonstrate that the electrical continuity of metal lines (width = 150 µm and length up to 1 cm) is maintained up to ~70% strain between the lines. The electrical resistance of such lines remains relatively stable: 35 Ω at zero-strain and 63 Ω at 69% average interline strain. The electrical resistivity of the evaporated gold is near to that of pure gold, and remains so even at high strains (49 nΩ m at 10% and 70 nΩ m at 41%)—this proves the absence strain-induced micro-cracking of the metal lines. Although a specific evaporated metal combination is used here to demonstrate a working prototype system, in principle, any thin-film material, which can be deposited by microfabrication, e.g. insulators, semiconductors..., could be integrated into the generic processes. The basic lithographic processes expounded here are also potentially extendible to encompass the integration of other microfabrication techniques, e.g. soft lithography, contact printing..., enabling more complex flexible systems to be envisaged and realized.

Fabrication of Bendable Circuits on a Polydimethylsiloxane (PDMS) Surface by Inkjet Printing Semi-Wrapped Structures

High-Resolution Rapid Prototyping of Liquid Metal Electronics by Direct Writing on Highly Prestretched Substrates

Direct-Writing Flexible Metal Circuit with Polymer/Metal Precursor Ink and Interfacial Reaction

Surface Modification of PDMS Thin Films for Printing Conductive Ink

Direct Writing Highly Conductive Silver Pattern on Flexible Substrate Based on Particle-Free and Ionic Liquid-Assisted Ink

Fabrication of Stretchable Circuits on Polydimethylsiloxane (PDMS) Pre-Stretched Substrates by Inkjet Printing Silver Nanoparticles

Airbrushing and surface modification for fabricating flexible electronics on polydimethylsiloxane

Fabrication of High-Resolution Flexible Circuits and Sensors Based on Liquid Metal Inks by Spraying and Wiping Processing.

Facial Fabrication of Paper-Based Flexible Electronics with Flash Foam Stamp Lithography

High-reproducibility, Flexible Conductive Patterns Fabricated with Silver Nanowire by Drop or Fit-to-flow Method

Fabrication of paper-based conductive patterns for flexible electronics by direct-writing

Introduction of a Chemical-Free Metal PDMS Thermal Bonding for Fabrication of Flexible Electrode by Metal Transfer onto PDMS

A Facile Fabrication Method of Silver Lines on PET with Good Adhesion at Room Temperature

Flexible conductor fabrication via silver nanowire deposition on a polydopamine-modified pre-strained substrate

Metallized SU-8 thin film patterns on stretchable PDMS

Direct Writing on Paper Substrate to Prepare Silver Electrode Structures for Flexible Sensors.

3D printing interface-modified PDMS/MXene nanocomposites for stretchable conductors

Amphiphilic Silver Nanoparticles for Inkjet-Printable Conductive Inks

Custom tailoring of conductive ink/substrate properties for increased thin film deposition of poly(dimethylsiloxane) films

Versatile fabrication of liquid metal nano-ink based flexible electronic devices

Flexible Electronics: Fast Fabrication of Flexible Functional Circuits Based on Liquid Metal Dual-Trans Printing (Adv. Mater. 44/2015).