Influence of thermal cycling on shape memory effect of a Fe-Mn-Si-Cr-Ni alloy

李晓兰,胥冬琴,文玉华,彭华备,余勤旭

DOI: https://doi.org/10.13289/j.issn.1009-6264.2012.08.005

2012-01-01

Abstract:Evolutions of microstructure and shape memory effect of a Fe-14Mn-5.5Si-8Cr-5Ni alloy with thermal cycling were investigated by OM observation and resistivity measurement. The results show that the shape recovery rate is markedly enhanced after one thermal cycle in the temperature range of 298 K-353 K,520 K,773 K and 77-773 K. The shape recovery rate increases by 26% and 36% after five thermal cycles of between 298-773 K and 77-773 K, respectively. The thermal cycling not only decreases remarkably the amount of thermal-induced e martensite produced by the quenching thermal stress, but also introduces lots of stacking faults resulting from the reverse transformation of thermal-induced e martensite. Compared to the solution treated alloy, the amount of ct＇ martensite after deformation decreases significantly, and the stress-induced e martensite forms in a domain manner after thermal cycling. This is the reason of the remarkable improvement of shape memory effect after thermal cycling. Because more stacking faults are introduced by the thermal cycling in the range of 77-773 K than that of 298-773 K, the shape memory effect is improved more remarkably by the thermal cycling of 77-773 K.