Abstract:In a recent study of diffusional creep in polycrystalline thin films deposited on substrates, we have discovered a new class of defects called the grain boundary diffusion wedges (Gao et al., Acta Mat. 47, pp. 2865–2878, 1999). These diffusion wedges are formed by stress driven mass transport between the free surface of the film and the grain boundaries during the process of substrate-constrained grain boundary diffusion. The mathematical modeling involves solution of integro-differential equations representing a strong coupling between elasticity and diffusion. The solution can be decomposed into diffusional eigenmodes reminiscent of crack-like opening displacement along the grain boundary which leads to a singular stress field at the root of the grain boundary. We find that the theoretical analysis successfully explains the difference between the mechanical behaviors of passivated and unpassivated copper films during thermal cycling on a silicon substrate. An important implication of our theoretical analysis is that dislocations with Burgers vector parallel to the interface can be nucleated at the root of the grain boundary. This is a new dislocation mechanism in thin films which contrasts to the well known Mathews-Freund-Nix mechanism of threading dislocation propagation. Recent TEM experiments at the Max Planck Institute for Metals Research have shown that, while threading dislocations dominate in passivated metal films, parallel glide dislocations begin to dominate in unpassivated copper films with thickness below 400 nm. This is consistent with our theoretical predictions. We have developed large scale molecular dynamics simulations of grain boundary diffusion wedges to clarify the nucleation mechanisms of parallel glide in thin films. Such atomic scale simulations of thin film diffusion not only show results which are consistent with both continuum theoretical and experimental studies, but also revealed the atomic processes of dislocation nucleation, climb, glide and storage in grain boundaries. The study should have far reaching implications for modeling deformation and diffusion in micro- and nanostructured materials.

Creep and stress relaxation in free-standing thin metal films controlled by coupled surface and grain boundary diffusion

Coupled Grain Boundary and Surface Diffusion in A Polycrystalline Thin Film Constrained by Substrate

Finite Element Study of the Creep Size-Effect in Thin Metal Films

Constrained Grain Boundary Diffusion in Thin Copper Films

5542 - MULTI-SCALE MODELING OF DEFORMATION IN POLYCRYSTALLINE THIN METAL FILMS

A mesoscopic characterization of creep in thin metal films

A Discrete Dislocation Plasticity Model of Creep in Polycrystalline Thin Films

FORMATION OF CRACK-LIKE DIFFUSION WEDGES AND COMPRESSIVE STRESS EVOLUTION DURING THIN FILM GROWTH WITH INHOMOGENEOUS GRAIN BOUNDARY DIFFUSIVITY

Residual Stress Relaxation in the Film/substrate System Due to Creep Deformation

Room temperature creep behavior of free-standing Cu films with bimodal grain size distribution

Analytical Solution for Coble Creep in Polycrystalline Materials under Biaxial Loading

Transient Stress Concentration in Diffusional Creep of A Thin Foil with Heterogeneous Grain Boundary Diffusivity

Recoverable Creep Deformation and Transient Local Stress Concentration Due to Heterogeneous Grain-Boundary Diffusion and Sliding in Polycrystalline Solids

Diffusive crack-grain interplay in freestanding nanocrystalline silver thin film

Electromigration-Induced Coble Creep in Polycrystalline Materials

Hierarchical Multi-Scale Modelling of Plasticity of Submicron Thin Metal Films

Creep and Stress Relaxation Behavior of Metal Matrix Particulate Composites Induced by Interface Diffusion with Coupled Thermomechanical Strains

Residual Stress Analysis in the Film/Substrate System with the Effect of Creep Deformation

The study of grain boundary density effect on multi-grain thin film under tension

Atomistic and Continuum Studies of Diffusional Creep and Associated Dislocation Mechanisms in Thin Films on Substrates

The Inter-Hole Interference on Creep Deformation Behavior of Nickel-Based Single Crystal Specimen with Film-Cooling Holes