Abstract:In a recent study of diffusional creep in polycrystalline thin films deposited on substrates, we have discovered a new class of defects called the grain boundary diffusion wedges (Gao et al., Acta Mat. 47, pp. 2865–2878, 1999). These diffusion wedges are formed by stress driven mass transport between the free surface of the film and the grain boundaries during the process of substrate-constrained grain boundary diffusion. The mathematical modeling involves solution of integro-differential equations representing a strong coupling between elasticity and diffusion. The solution can be decomposed into diffusional eigenmodes reminiscent of crack-like opening displacement along the grain boundary which leads to a singular stress field at the root of the grain boundary. We find that the theoretical analysis successfully explains the difference between the mechanical behaviors of passivated and unpassivated copper films during thermal cycling on a silicon substrate. An important implication of our theoretical analysis is that dislocations with Burgers vector parallel to the interface can be nucleated at the root of the grain boundary. This is a new dislocation mechanism in thin films which contrasts to the well known Mathews-Freund-Nix mechanism of threading dislocation propagation. Recent TEM experiments at the Max Planck Institute for Metals Research have shown that, while threading dislocations dominate in passivated metal films, parallel glide dislocations begin to dominate in unpassivated copper films with thickness below 400 nm. This is consistent with our theoretical predictions. We have developed large scale molecular dynamics simulations of grain boundary diffusion wedges to clarify the nucleation mechanisms of parallel glide in thin films. Such atomic scale simulations of thin film diffusion not only show results which are consistent with both continuum theoretical and experimental studies, but also revealed the atomic processes of dislocation nucleation, climb, glide and storage in grain boundaries. The study should have far reaching implications for modeling deformation and diffusion in micro- and nanostructured materials.

Residual Plastic Strain Recovery Driven by Grain Boundary Diffusion in Nanocrystalline Thin Films

Competing grain-boundary- and dislocation-mediated mechanisms in plastic strain recovery in nanocrystalline aluminum

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Grain Rotation In Plastic Deformation

Diffusive crack-grain interplay in freestanding nanocrystalline silver thin film

Recoverable Creep Deformation Due to Heterogeneous Grain-Boundary Diffusion and Sliding

Dislocation Depleted Deformation in Nano-Grained Metals

Regain Strain-Hardening in High-Strength Metals by Nanofiller Incorporation at Grain Boundaries.

An Elastic–viscoplastic Model of Deformation in Nanocrystalline Metals Based on Coupled Mechanisms in Grain Boundaries and Grain Interiors

Strain localization in a nanocrystalline metal: Atomic mechanisms and the effect of testing conditions

Hierarchical Multi-Scale Modelling of Plasticity of Submicron Thin Metal Films

Recoverable Creep Deformation and Transient Local Stress Concentration Due to Heterogeneous Grain-Boundary Diffusion and Sliding in Polycrystalline Solids

Deformation and Diffusion in Nano-grained Metals

Plastic strain-induced grain refinement at the nanometer scale in copper

Quantitative tracking of grain structure evolution in a nanocrystalline metal during cyclic loading

Constrained Grain Boundary Diffusion in Thin Copper Films

A dislocation-density-based crystal plasticity model for FCC nanocrystalline metals incorporating thermally-activated depinning from grain boundaries

Metallic Nanocrystals with Low Angle Grain Boundary for Controllable Plastic Reversibility

Emergence of localized plasticity and failure through shear banding during microcompression of a nanocrystalline alloy

Enhanced Strain-Rate Sensitivity in Fcc Nanocrystals Due to Grain-Boundary Diffusion and Sliding

Direct Dynamic Atomic Mechanisms of Strain-Induced Grain Rotation in Nanocrystalline, Textured, Columnar-Structured Thin Gold Films