A study on pore-forming agent in the resin bond diamond wheel used for silicon wafer back-grinding

Kehua Li,Qiang Guo,Mingyao Liu,Yanjun Zhao,Dongli Shi
DOI: https://doi.org/10.1016/j.proeng.2012.03.047
2012-01-01
Procedia Engineering
Abstract:Thinner thickness of the subsurface damage (SSD) layer and lower surface roughness of the grinded silicon wafers should be required, which would depend on high self-sharpening ability and consistent performance of the resin bond diamond wheel used in back-grinding. In this paper application of the pore-forming agent for improving these properties of the grinding wheel was experimentally studied. The bonding strength and the grinding performance of the resin-bond diamond wheel affected by the pore-forming agent were evaluated by testing.
What problem does this paper attempt to address?