Breakdown on Interconnect System of Printed Circuit Board under Square Wave Pulse

MENG Guodong,CHENG Yonghong,YOU Xiaoguang,WU Kai,LIU Ying

2012-01-01

Abstract:Electrical breakdown characteristics of interconnect system on printed circuit board(PCB) under square pulse are investigated with direct pulse injection.And the performance evaluation for the interconnect system insulation is carried out according to the experimental results.Following the fact that the breakdown behaviors agree with Weibull distribution,the curves of cumulative failure rate under the conditions of different insulation gap distances and different injection pulse widths are obtained by statistical analysis.It is indicated that as parallel interconnects on PCB are injected with square pulse,the breakdown field strength increases with the decreasing insulation distance,accompanied with two distinct phases;breakdown field strength also decreases with increasing injection pulse width.Compared with the breakdown characteristics and morphology before and after breakdown,the breakdown behavior between parallel interconnects on PCB is thought as solid-gas composite dielectric accompanied by an unrecoverable dielectric strength.The insulation failure rate curves of samples under different conditions are obtained by Weibull statistical methods to provide an important reference for the insulation performance evaluation of similar devices under the impact of square pulse.