In Situ Tem Study on Crack Propagation in Nanoscale Au Thin Films

Hongtao Wang,Anmin Nie,Jiabin Liu,Peng Wang,Wei Yang,Bangdao Chen,Hongzhong Liu,Maosen Fu
DOI: https://doi.org/10.1016/j.scriptamat.2011.05.009
IF: 6.302
2011-01-01
Scripta Materialia
Abstract:In situ straining in nanocrystalline Au thin films reveals a new fracture mechanism, i.e. crack propagation by atomic migration. The crack propagates by repetitively nucleating and moving atomic steps from the tip region to the crack rear. The stress concentration at the tip helps in the step nucleation process. The elastic energy density at the notch root decreases with increasing notch angle, which implies cracks with small angles can propagate along grain boundaries more easily. (C) 2011 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
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