Design of Solid State Array for Simultaneous Potentiometric and Impedance Sensing in Gas Phase

BJ Polk,JA Smith,SP DeWeerth,ZP Zhou,J Janata,K Domansky
DOI: https://doi.org/10.1002/(sici)1521-4109(199907)11:10/11<707::aid-elan707>3.0.co;2-3
IF: 3.077
1999-01-01
Electroanalysis
Abstract:A general sensing platform consisting of eight modules has bean designed and fabricated in silicon. The operating function of this platform has been divided between a chemical sensing chip (CSC) and an electronic service chip (ESC). The CSC uses a gold metallization and a high temperature silicon nitride as the passivation layer. The smallest feature size on the CSC is 20 mu m. It houses eight sensing modules each consisting of a pair of gold electrodes for measurement of impedance of the conducting polymer and a field-effect transistor for measurement of chemical modulation of the work function of the same polymer. The modules are separated from each other by a patterned 25 mu m thick polyimide. Fhe ESC was fabricated by a standard CMOS technology with 1.25 mu m feature size. The CSC and ESC chips are connected by flip-chip bonding which greatly simplifies the packaging. The operation of the combined impedance and work function sensing has been verified by exposure to ammonia in ppm range.
What problem does this paper attempt to address?