A Micromechanical Failure Study of As(4)/Peek Composites

SB Wang,DS Dong,ZY Wang,P Goudeau,LA Li,JW Tong
DOI: https://doi.org/10.4028/www.scientific.net/kem.274-276.355
2004-01-01
Abstract:A new digital image correlation method is presented, which combines the theories of correlation and wavelet transforms. The digital image of the natural surface of sample or specimen is considered as a two-dimensional mathematical function. This paper proves that the correlation coefficients of two functions can be achieved and expressed by their wavelet transformations, and the corresponding algorithm is given in the paper. The experimental system consists of an objective of microscope, the light source, digital image processing and software systems. In the experiment, the images of the natural surface of specimen before and after the deformation are captured and processed by the new algorithm. The application is demonstrated for experiments on damage evaluation of laminated composites AS4/PEEK(0/ ± 45/90) 7S under bending. The precision of displacement measurement is 0.01-0.05 pixel. Finally, the finite element analysis and damage mechanics of above material under same load is investigated and discussed. The numerical simulation has been carried out using three-dimensional orthotropic elastic finite element model. Simulated stress and strain fields ( ij ij e σ , ) of the laminated composites AS4/PEEK(0/±45/90) 7S under different loadings are presented in this paper. This method has its potential application in micro electronics, electronic packaging and thermo-mechanical reliability studies on micro and nano scale by AFM and SEM
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