Liquid Crystalline Polyimide Films with High Intrinsic Thermal Conductivities and Robust Toughness
Kunpeng Ruan,Yongqiang Guo,Junwei Gu
DOI: https://doi.org/10.1021/acs.macromol.1c00686
IF: 5.5
2021-05-12
Macromolecules
Abstract:Low intrinsic thermal conductivity coefficients (λ) of polyimide (PI) films limit their application in heat-prone flexible electronics. By optimizing the liquid crystal range to fit the curing temperature, novel kinds of intrinsically highly thermally conductive liquid crystalline PI (LC-PI) films are fabricated. When the molar ratio of 4,4′-diaminodiphenyl ether (ODA) to 1, 4-bis(4-aminophenoxy)benzene (TPE-Q) is 1:3 (sample no. IV), liquid crystal range of <i>pre</i>LC-PI<sub>IV</sub> films is 272∼388 °C, including curing temperature of 350 °C. The LC-PI<sub>IV</sub> films cured in liquid crystal range retain liquid crystal texture to room temperature, and the in-plane λ (λ<sub>∥</sub>) and through-plane λ (λ<sub>⊥</sub>) at room temperature reach 2.11 W/(m·K) and 0.32 W/(m·K), respectively, significantly higher than λ<sub>∥</sub> (0.77 W/(m·K)) and λ<sub>⊥</sub> (0.15 W/(m·K)) of LC-PI<sub>I</sub> films which are cured out of the liquid crystal range. Meanwhile, LC-PI<sub>IV</sub> films possess excellent mechanical and thermal properties, showing application prospects in high-heating flexible electronics.The Supporting Information is available free of charge at <a class="ext-link" href="/doi/10.1021/acs.macromol.1c00686?goto=supporting-info">https://pubs.acs.org/doi/10.1021/acs.macromol.1c00686</a>.S1, experimental section; S1.1, main materials; S1.2, characterizations; S2, supporting results; Figure S1, molecular weight distribution curves of 5 kinds of PAA; Table S1, comparison of characterized number-averaged molecular weight with theoretical values of 5 kinds of PAA; Figure S2, FTIR spectra of 5 kinds of PAA (a), <i>pre</i>LC-PI films before curing (b), and <i>pre</i>LC-PI<sub>IV</sub> films after thermal treatment of 250 °C/5 h, 275 °C/5 h, 300 °C/5 h, 325 °C/5 h, and 350 °C/5 h (c); Figure S3, POM images of LC-PI<sub>I</sub> (a), LC-PI<sub>II</sub> (b), LC-PI<sub>III</sub> (c), and LC-PI<sub>V</sub> (d) films at room temperature; Figure S4, tensile stress–strain curves of LC-PI films; Figure S5, tensile stress–strain curve of N–PI films; and Table S2, thermal characteristic data of LC-PI films (<a class="ext-link" href="/doi/suppl/10.1021/acs.macromol.1c00686/suppl_file/ma1c00686_si_001.pdf">PDF</a>)This article has not yet been cited by other publications.
polymer science