Preparation and Properties of High Heat-resistant Polyimide Films for Flexible OLED

Jiao Long,Dai Xuemin,Mu Jianxin,Du Zhijun,Wang Hanfu,Dong Zhixin,Qiu Xuepeng
DOI: https://doi.org/10.7503/cjcu20220390
2022-01-01
Abstract:The glass transition temperature(T-g) of greater than 450 degrees C and the coefficient of thermal expansion (CTE)between 0 and 5x10(-6) K-1 are required for the application of polyimide(PI) films as flexible organic lightemitting display(OLED)substrates. In order to improve the thermal properties of PI films,a series of novel PI films was prepared by the copolymerization of homemade 2,7-diaminoxanthone(2,7-DAX)with pyromellitic acid dianhydride(PMDA) and 2-(4-aminophenyl)-5-aminobenzoxazole(BOA). The aggregation structure, heat resistance, dimensional stability and mechanical properties of the films were investigated. The results show that the rigidity and linearity of PI molecular chain are improved by the structure of xanthone and benzoxazole,and the molecular chain is closely packed and oriented in the plane. The synthesized PI film has excellent comprehensive properties,with T-g>408 degrees C,CTE between - 5.0x10(-6) and 8.1x10(-6) K-1,tensile strength>140 MPa,tensile modulus>4.2 GPa,the elongation at break between 7.1% and 20%,and the thermogravimetric decomposition temperature(T-5%) between 601 and 624 degrees C. Among them,PI-50 and PI-60 films have ultra-high T-g(>450 degrees C)and ultra-low CTE(2.1x10(-6) K-1 and 1.6x10(-6) K-1),respectively. The PI films prepared have potential application prospects as flexible OLED substrate materials.
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