Substrate Deformation Studies on Direct-Overwriting (DOW) of Phase-Change Rewritable Optical Disc
P.K. Tan,Kam‐Ho Wong,Hongyan Yao,Meng Hua,Xiangshui Miao,Lu Shi,Kian Guan Lim,Kaijun Yi,Zhao Rong,Chong
DOI: https://doi.org/10.1364/ods.2003.tue16
2003-01-01
Abstract:In phase-change (PC) optical recording technology, one of the problems was the overwriting (OW) cycles. PC optical recording technology has disadvantages of lesser overwrite cycles (1000 to 100000 times for commercial products) compared to magneto-optical technology (unlimited OW cycles). Therefore it is important to understand and improve the OW properties of the PC disc. Many OW behaviors of PC disc studies, such as OW cycle degradation model [1], microstructural studies [2, 3], rapid cooling structure [4], film adhesion study [5] and material study [4, 6, 7] have been carried out. Most of the study areas were in the material composition, microstructure and disc structure. In this paper, we study the effect of OW toward the polycarbonate substrate. As we know, glass transition temperature of polycarbonate substrate is about 120oC, at this temperature the material will start soften. In the writing process of the PC optical disc, in order to write an amorphous mark, the PC must be melt and quench rapidly. Since melting temperature of PC material is over 600oC and the distance between PC layer & polycarbonate was so small (about 100nm) compare to the mark size, it is possible that the thermal energy flow will be high enough to damage the substrate, thus reduce the OW cycles.