The design of vision location system in automatic high-speed die bonder

Xiao-feng WU,Xue-piug LIU,Song-qing ZOU
DOI: https://doi.org/10.3969/j.issn.1001-3997.2008.06.024
2008-01-01
Abstract:Based on the research on machine vision location system in die bonder which used in semiconductor package, the design of hardware and software were developed. The hardware consists of Image acquisition and pre-process subsystem Optical imaging subsystem electromotor control subsystem, the software is to divide into modules, and comments on template-learn location tactic pixel-pulse conversion in details. The result of experiment shows that the system have a reasonable structure, meet the need of design requirements, the one cycle time of image acquisition and process can be controlled in 50ms.
What problem does this paper attempt to address?